Empirical Study on Specification Metrics to Predict Volatility and Software Defects

Taketo Tsunoda, Hironori Washizaki, Yoshiaki Fukazawa, Sakae Inoue, Yoshiiku Hanai, Masanobu Kanazawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Successful software implementation needs high-quality software requirement specifications (SRSs). However, SRSs are not only difficult to evaluate quantitatively, but there is not an effective indicator to predict which SRSs are prone to modifications. Moreover, few studies have investigated the impact of SRS quality on software quality. Herein we use two specification metrics for SRSs to evaluate their effectiveness to predict future modifications in two actual developments. The results show that our metrics are useful to predict future specification modifications and our specifications are closely related with software quality.

Original languageEnglish
Title of host publicationProceedings of TENCON 2018 - 2018 IEEE Region 10 Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages2479-2484
Number of pages6
ISBN (Electronic)9781538654576
DOIs
Publication statusPublished - 2019 Feb 22
Event2018 IEEE Region 10 Conference, TENCON 2018 - Jeju, Korea, Republic of
Duration: 2018 Oct 282018 Oct 31

Publication series

NameIEEE Region 10 Annual International Conference, Proceedings/TENCON
Volume2018-October
ISSN (Print)2159-3442
ISSN (Electronic)2159-3450

Conference

Conference2018 IEEE Region 10 Conference, TENCON 2018
CountryKorea, Republic of
CityJeju
Period18/10/2818/10/31

Keywords

  • Empirical Study
  • Metrics
  • Quality
  • Specification
  • Styling

ASJC Scopus subject areas

  • Computer Science Applications
  • Electrical and Electronic Engineering

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    Tsunoda, T., Washizaki, H., Fukazawa, Y., Inoue, S., Hanai, Y., & Kanazawa, M. (2019). Empirical Study on Specification Metrics to Predict Volatility and Software Defects. In Proceedings of TENCON 2018 - 2018 IEEE Region 10 Conference (pp. 2479-2484). [8650274] (IEEE Region 10 Annual International Conference, Proceedings/TENCON; Vol. 2018-October). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/TENCON.2018.8650274