Empirical Study on Specification Metrics to Predict Volatility and Software Defects

Taketo Tsunoda, Hironori Washizaki, Yoshiaki Fukazawa, Sakae Inoue, Yoshiiku Hanai, Masanobu Kanazawa

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    Successful software implementation needs high-quality software requirement specifications (SRSs). However, SRSs are not only difficult to evaluate quantitatively, but there is not an effective indicator to predict which SRSs are prone to modifications. Moreover, few studies have investigated the impact of SRS quality on software quality. Herein we use two specification metrics for SRSs to evaluate their effectiveness to predict future modifications in two actual developments. The results show that our metrics are useful to predict future specification modifications and our specifications are closely related with software quality.

    Original languageEnglish
    Title of host publicationProceedings of TENCON 2018 - 2018 IEEE Region 10 Conference
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages2479-2484
    Number of pages6
    ISBN (Electronic)9781538654576
    DOIs
    Publication statusPublished - 2019 Feb 22
    Event2018 IEEE Region 10 Conference, TENCON 2018 - Jeju, Korea, Republic of
    Duration: 2018 Oct 282018 Oct 31

    Publication series

    NameIEEE Region 10 Annual International Conference, Proceedings/TENCON
    Volume2018-October
    ISSN (Print)2159-3442
    ISSN (Electronic)2159-3450

    Conference

    Conference2018 IEEE Region 10 Conference, TENCON 2018
    CountryKorea, Republic of
    CityJeju
    Period18/10/2818/10/31

    Fingerprint

    Specifications
    Defects

    Keywords

    • Empirical Study
    • Metrics
    • Quality
    • Specification
    • Styling

    ASJC Scopus subject areas

    • Computer Science Applications
    • Electrical and Electronic Engineering

    Cite this

    Tsunoda, T., Washizaki, H., Fukazawa, Y., Inoue, S., Hanai, Y., & Kanazawa, M. (2019). Empirical Study on Specification Metrics to Predict Volatility and Software Defects. In Proceedings of TENCON 2018 - 2018 IEEE Region 10 Conference (pp. 2479-2484). [8650274] (IEEE Region 10 Annual International Conference, Proceedings/TENCON; Vol. 2018-October). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/TENCON.2018.8650274

    Empirical Study on Specification Metrics to Predict Volatility and Software Defects. / Tsunoda, Taketo; Washizaki, Hironori; Fukazawa, Yoshiaki; Inoue, Sakae; Hanai, Yoshiiku; Kanazawa, Masanobu.

    Proceedings of TENCON 2018 - 2018 IEEE Region 10 Conference. Institute of Electrical and Electronics Engineers Inc., 2019. p. 2479-2484 8650274 (IEEE Region 10 Annual International Conference, Proceedings/TENCON; Vol. 2018-October).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Tsunoda, T, Washizaki, H, Fukazawa, Y, Inoue, S, Hanai, Y & Kanazawa, M 2019, Empirical Study on Specification Metrics to Predict Volatility and Software Defects. in Proceedings of TENCON 2018 - 2018 IEEE Region 10 Conference., 8650274, IEEE Region 10 Annual International Conference, Proceedings/TENCON, vol. 2018-October, Institute of Electrical and Electronics Engineers Inc., pp. 2479-2484, 2018 IEEE Region 10 Conference, TENCON 2018, Jeju, Korea, Republic of, 18/10/28. https://doi.org/10.1109/TENCON.2018.8650274
    Tsunoda T, Washizaki H, Fukazawa Y, Inoue S, Hanai Y, Kanazawa M. Empirical Study on Specification Metrics to Predict Volatility and Software Defects. In Proceedings of TENCON 2018 - 2018 IEEE Region 10 Conference. Institute of Electrical and Electronics Engineers Inc. 2019. p. 2479-2484. 8650274. (IEEE Region 10 Annual International Conference, Proceedings/TENCON). https://doi.org/10.1109/TENCON.2018.8650274
    Tsunoda, Taketo ; Washizaki, Hironori ; Fukazawa, Yoshiaki ; Inoue, Sakae ; Hanai, Yoshiiku ; Kanazawa, Masanobu. / Empirical Study on Specification Metrics to Predict Volatility and Software Defects. Proceedings of TENCON 2018 - 2018 IEEE Region 10 Conference. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 2479-2484 (IEEE Region 10 Annual International Conference, Proceedings/TENCON).
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