Enhanced partial discharge resistance of epoxy/clay nanocomposite prepared by newly developed organic modification and solubilization methods

Toshikatsu Tanaka; Yoshimichi Ohki; Mitsukazu Ochi; Miyuki Harada; Takahiro Imai

doi:10.1109/T-DEI.2008.4446739

Enhanced partial discharge resistance of epoxy/clay nanocomposite prepared by newly developed organic modification and solubilization methods

Toshikatsu Tanaka, Yoshimichi Ohki, Mitsukazu Ochi, Miyuki Harada, Takahiro Imai

Research output: Contribution to journal › Article

129 Citations (Scopus)

Abstract

Frequency accelerated partial discharge (PD) aging of epoxy nanocomposite with 5 wt % additions of clay was investigated in comparison with that of epoxy without clay in terms of PD erosion depth. It was found that the change in the erosion depth is far smaller in specimens with clay than those without clay. The newly developed organic modification and solubilization methods give comparable PD resistance characteristics. The latter would be more resistant to PD's than the former, if specimens were prepared properly. It was clarified that nano-micro mixed composites were superior to the single nanocomposite. Nano segmentation with some interaction zone effect is proposed as a mechanism of improvement in PD resistance.

Original language	English
Pages (from-to)	81-89
Number of pages	9
Journal	IEEE Transactions on Dielectrics and Electrical Insulation
Volume	15
Issue number	1
DOIs	https://doi.org/10.1109/T-DEI.2008.4446739
Publication status	Published - 2008 Feb 1
Externally published	Yes

Keywords

Epoxy nanocomposite
Epoxy resin
Frequency acceleration
Partial discharge
Surface degradation

ASJC Scopus subject areas

Electrical and Electronic Engineering

Access to Document

10.1109/T-DEI.2008.4446739

Fingerprint Dive into the research topics of 'Enhanced partial discharge resistance of epoxy/clay nanocomposite prepared by newly developed organic modification and solubilization methods'. Together they form a unique fingerprint.

Cite this

Enhanced partial discharge resistance of epoxy/clay nanocomposite prepared by newly developed organic modification and solubilization methods. / Tanaka, Toshikatsu; Ohki, Yoshimichi; Ochi, Mitsukazu; Harada, Miyuki; Imai, Takahiro.

In: IEEE Transactions on Dielectrics and Electrical Insulation, Vol. 15, No. 1, 01.02.2008, p. 81-89.

Research output: Contribution to journal › Article

@article{537a46e6ed59431badb867a4579a1ada,

title = "Enhanced partial discharge resistance of epoxy/clay nanocomposite prepared by newly developed organic modification and solubilization methods",

abstract = "Frequency accelerated partial discharge (PD) aging of epoxy nanocomposite with 5 wt % additions of clay was investigated in comparison with that of epoxy without clay in terms of PD erosion depth. It was found that the change in the erosion depth is far smaller in specimens with clay than those without clay. The newly developed organic modification and solubilization methods give comparable PD resistance characteristics. The latter would be more resistant to PD's than the former, if specimens were prepared properly. It was clarified that nano-micro mixed composites were superior to the single nanocomposite. Nano segmentation with some interaction zone effect is proposed as a mechanism of improvement in PD resistance.",

keywords = "Epoxy nanocomposite, Epoxy resin, Frequency acceleration, Partial discharge, Surface degradation",

author = "Toshikatsu Tanaka and Yoshimichi Ohki and Mitsukazu Ochi and Miyuki Harada and Takahiro Imai",

year = "2008",

month = feb,

day = "1",

doi = "10.1109/T-DEI.2008.4446739",

language = "English",

volume = "15",

pages = "81--89",

journal = "IEEE Transactions on Dielectrics and Electrical Insulation",

issn = "1070-9878",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "1",

}

TY - JOUR

T1 - Enhanced partial discharge resistance of epoxy/clay nanocomposite prepared by newly developed organic modification and solubilization methods

AU - Tanaka, Toshikatsu

AU - Ohki, Yoshimichi

AU - Ochi, Mitsukazu

AU - Harada, Miyuki

AU - Imai, Takahiro

PY - 2008/2/1

Y1 - 2008/2/1

N2 - Frequency accelerated partial discharge (PD) aging of epoxy nanocomposite with 5 wt % additions of clay was investigated in comparison with that of epoxy without clay in terms of PD erosion depth. It was found that the change in the erosion depth is far smaller in specimens with clay than those without clay. The newly developed organic modification and solubilization methods give comparable PD resistance characteristics. The latter would be more resistant to PD's than the former, if specimens were prepared properly. It was clarified that nano-micro mixed composites were superior to the single nanocomposite. Nano segmentation with some interaction zone effect is proposed as a mechanism of improvement in PD resistance.

AB - Frequency accelerated partial discharge (PD) aging of epoxy nanocomposite with 5 wt % additions of clay was investigated in comparison with that of epoxy without clay in terms of PD erosion depth. It was found that the change in the erosion depth is far smaller in specimens with clay than those without clay. The newly developed organic modification and solubilization methods give comparable PD resistance characteristics. The latter would be more resistant to PD's than the former, if specimens were prepared properly. It was clarified that nano-micro mixed composites were superior to the single nanocomposite. Nano segmentation with some interaction zone effect is proposed as a mechanism of improvement in PD resistance.

KW - Epoxy nanocomposite

KW - Epoxy resin

KW - Frequency acceleration

KW - Partial discharge

KW - Surface degradation

UR - http://www.scopus.com/inward/record.url?scp=38949184945&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=38949184945&partnerID=8YFLogxK

U2 - 10.1109/T-DEI.2008.4446739

DO - 10.1109/T-DEI.2008.4446739

M3 - Article

AN - SCOPUS:38949184945

VL - 15

SP - 81

EP - 89

JO - IEEE Transactions on Dielectrics and Electrical Insulation

JF - IEEE Transactions on Dielectrics and Electrical Insulation

SN - 1070-9878

IS - 1

ER -