Enhancement of the ductility of electrodeposited copper films by room-temperature recrystallization

Madoka Hasegawa, Yuichi Nonaka, Yoshinori Negishi, Yutaka Okinaka, Tetsuya Osaka

Research output: Contribution to journalArticle

26 Citations (Scopus)

Abstract

In conjunction with a study of the copper electrodeposition process from the acid copper sulfate bath for the fabrication of interconnections of printed circuit boards and semiconductor devices, an investigation was performed of the effect of bath additives on the relationship between the ductility of the copper deposit and its crystallographic structure and electrical resistivity. Room-temperature recrystallization, or so-called self-annealing, is known to occur in copper electrodeposits obtained from baths containing Cl-, polyethylene glycol, and bis(3-sulfopropyl)disulfide as additives. Variation with time of the crystallographic orientation, grain size, and resistivity of the deposit was followed over a period of several weeks after the deposition. During the period of self-annealing, ductility was found to increase by a factor of 1.5. The increase in ductility is shown to be related to a change in microstructure of the copper deposit.

Original languageEnglish
JournalJournal of the Electrochemical Society
Volume153
Issue number2
DOIs
Publication statusPublished - 2006

Fingerprint

ductility
Copper deposits
Ductility
Copper
copper
augmentation
room temperature
baths
Annealing
Copper Sulfate
deposits
electrical resistivity
Semiconductor devices
Electrodeposition
Printed circuit boards
Disulfides
Temperature
Polyethylene glycols
Deposits
annealing

ASJC Scopus subject areas

  • Electrochemistry
  • Surfaces, Coatings and Films
  • Surfaces and Interfaces

Cite this

Enhancement of the ductility of electrodeposited copper films by room-temperature recrystallization. / Hasegawa, Madoka; Nonaka, Yuichi; Negishi, Yoshinori; Okinaka, Yutaka; Osaka, Tetsuya.

In: Journal of the Electrochemical Society, Vol. 153, No. 2, 2006.

Research output: Contribution to journalArticle

Hasegawa, Madoka ; Nonaka, Yuichi ; Negishi, Yoshinori ; Okinaka, Yutaka ; Osaka, Tetsuya. / Enhancement of the ductility of electrodeposited copper films by room-temperature recrystallization. In: Journal of the Electrochemical Society. 2006 ; Vol. 153, No. 2.
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