Enhancement of the ductility of electrodeposited copper films by room-temperature recrystallization

Madoka Hasegawa*, Yuichi Nonaka, Yoshinori Negishi, Yutaka Okinaka, Tetsuya Osaka

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

35 Citations (Scopus)


In conjunction with a study of the copper electrodeposition process from the acid copper sulfate bath for the fabrication of interconnections of printed circuit boards and semiconductor devices, an investigation was performed of the effect of bath additives on the relationship between the ductility of the copper deposit and its crystallographic structure and electrical resistivity. Room-temperature recrystallization, or so-called self-annealing, is known to occur in copper electrodeposits obtained from baths containing Cl-, polyethylene glycol, and bis(3-sulfopropyl)disulfide as additives. Variation with time of the crystallographic orientation, grain size, and resistivity of the deposit was followed over a period of several weeks after the deposition. During the period of self-annealing, ductility was found to increase by a factor of 1.5. The increase in ductility is shown to be related to a change in microstructure of the copper deposit.

Original languageEnglish
Pages (from-to)C117-C120
JournalJournal of the Electrochemical Society
Issue number2
Publication statusPublished - 2006 Jan 20

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Renewable Energy, Sustainability and the Environment
  • Surfaces, Coatings and Films
  • Electrochemistry
  • Materials Chemistry


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