Envelope Estimation by Tangentially Constrained Spline

Tsubasa Kusano, Kohei Yatabe, Yasuhiro Oikawa

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    3 Citations (Scopus)

    Abstract

    Estimating envelope of a signal has various applications including empirical mode decomposition (EMD) in which the cubic C^2 -spline based envelope estimation is generally used. While such functional approach can easily control smoothness of an estimated envelope, the so-called undershoot problem often occurs that violates the basic requirement of envelope. In this paper, a tangentially constrained spline with tangential points optimization is proposed for avoiding the undershoot problem while maintaining smoothness. It is defined as a quartic C^2 -spline function constrained with first derivatives at tangential points that effectively avoids undershoot. The tangential points optimization method is proposed in combination with this spline to attain optimal smoothness of the estimated envelope.

    Original languageEnglish
    Title of host publication2018 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2018 - Proceedings
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages4374-4378
    Number of pages5
    Volume2018-April
    ISBN (Print)9781538646588
    DOIs
    Publication statusPublished - 2018 Sep 10
    Event2018 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2018 - Calgary, Canada
    Duration: 2018 Apr 152018 Apr 20

    Other

    Other2018 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2018
    CountryCanada
    CityCalgary
    Period18/4/1518/4/20

    Fingerprint

    Splines
    Derivatives
    Decomposition

    Keywords

    • Adjoint-state method
    • Constrained optimization
    • Empirical mode decomposition (EMD)
    • Quartic -spline
    • Spline interpolation

    ASJC Scopus subject areas

    • Software
    • Signal Processing
    • Electrical and Electronic Engineering

    Cite this

    Kusano, T., Yatabe, K., & Oikawa, Y. (2018). Envelope Estimation by Tangentially Constrained Spline. In 2018 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2018 - Proceedings (Vol. 2018-April, pp. 4374-4378). [8462203] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICASSP.2018.8462203

    Envelope Estimation by Tangentially Constrained Spline. / Kusano, Tsubasa; Yatabe, Kohei; Oikawa, Yasuhiro.

    2018 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2018 - Proceedings. Vol. 2018-April Institute of Electrical and Electronics Engineers Inc., 2018. p. 4374-4378 8462203.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Kusano, T, Yatabe, K & Oikawa, Y 2018, Envelope Estimation by Tangentially Constrained Spline. in 2018 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2018 - Proceedings. vol. 2018-April, 8462203, Institute of Electrical and Electronics Engineers Inc., pp. 4374-4378, 2018 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2018, Calgary, Canada, 18/4/15. https://doi.org/10.1109/ICASSP.2018.8462203
    Kusano T, Yatabe K, Oikawa Y. Envelope Estimation by Tangentially Constrained Spline. In 2018 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2018 - Proceedings. Vol. 2018-April. Institute of Electrical and Electronics Engineers Inc. 2018. p. 4374-4378. 8462203 https://doi.org/10.1109/ICASSP.2018.8462203
    Kusano, Tsubasa ; Yatabe, Kohei ; Oikawa, Yasuhiro. / Envelope Estimation by Tangentially Constrained Spline. 2018 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2018 - Proceedings. Vol. 2018-April Institute of Electrical and Electronics Engineers Inc., 2018. pp. 4374-4378
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