Envelope Estimation by Tangentially Constrained Spline

Tsubasa Kusano, Kohei Yatabe, Yasuhiro Oikawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

Estimating envelope of a signal has various applications including empirical mode decomposition (EMD) in which the cubic C^2 -spline based envelope estimation is generally used. While such functional approach can easily control smoothness of an estimated envelope, the so-called undershoot problem often occurs that violates the basic requirement of envelope. In this paper, a tangentially constrained spline with tangential points optimization is proposed for avoiding the undershoot problem while maintaining smoothness. It is defined as a quartic C^2 -spline function constrained with first derivatives at tangential points that effectively avoids undershoot. The tangential points optimization method is proposed in combination with this spline to attain optimal smoothness of the estimated envelope.

Original languageEnglish
Title of host publication2018 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2018 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages4374-4378
Number of pages5
ISBN (Print)9781538646588
DOIs
Publication statusPublished - 2018 Sep 10
Event2018 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2018 - Calgary, Canada
Duration: 2018 Apr 152018 Apr 20

Publication series

NameICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings
Volume2018-April
ISSN (Print)1520-6149

Other

Other2018 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2018
Country/TerritoryCanada
CityCalgary
Period18/4/1518/4/20

Keywords

  • Adjoint-state method
  • Constrained optimization
  • Empirical mode decomposition (EMD)
  • Quartic -spline
  • Spline interpolation

ASJC Scopus subject areas

  • Software
  • Signal Processing
  • Electrical and Electronic Engineering

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