Evaluation of hybrid bonding technology of single-micron pitch with planar structure for 3D interconnection

Masaki Ohyama, Masatsugu Nimura, Jun Mizuno, Shuichi Shoji, Toshihisa Nonaka, Yoichi Shinba, Akitsu Shigetou

Research output: Contribution to journalArticle

8 Citations (Scopus)

Abstract

In this paper, we describe hybrid bonding technology of single-micron pitch with planar structure for three-dimensional (3D) interconnection. Conventionally, underfill method utilizing capillary force was used after the bonding of microbump. However, the filling becomes insufficient in a gap less than 10. μm between chips or bumps. One promising technology is the hybrid bonding technology that microbumps and an adhesive can be simultaneously bonded. To realize a single-micron pitch hybrid bonding, we fabricated a planar structure that consists of 8. μm-pitch Cu/Sn microbumps and a non-conductive film (NCF) by a chemical mechanical polishing (CMP) of resin. After planarization, the Cu/Sn bumps and the NCF were simultaneously bonded at 250. °C for 60. s. Cross-sectional scanning electron microscope (SEM) images and energy dispersive X-ray spectroscopy (EDX) images show that the adhesive resin on the bump surface was successfully removed by the CMP. In addition, SEM images of the bonded sample show that the adhesive filled the 2.5-μm gap between the chip and substrate. The Cu/Sn bumps were properly bonded in a corner on the chip. The proposed bonding method is expected to enable single-micron pitch interconnection for ultra-high density 3D LSI of next generation.

Original languageEnglish
JournalMicroelectronics Reliability
DOIs
Publication statusAccepted/In press - 2014 Nov 3

Fingerprint

planar structures
evaluation
adhesives
Adhesives
Chemical mechanical polishing
chips
polishing
resins
Electron microscopes
Resins
electron microscopes
Scanning
scanning
large scale integration
Substrates
spectroscopy
x rays
energy

Keywords

  • 3D integration
  • Chemical mechanical polishing
  • Hybrid bonding
  • Non-conductive film
  • Single-micron pitch
  • Underfill

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Safety, Risk, Reliability and Quality

Cite this

Evaluation of hybrid bonding technology of single-micron pitch with planar structure for 3D interconnection. / Ohyama, Masaki; Nimura, Masatsugu; Mizuno, Jun; Shoji, Shuichi; Nonaka, Toshihisa; Shinba, Yoichi; Shigetou, Akitsu.

In: Microelectronics Reliability, 03.11.2014.

Research output: Contribution to journalArticle

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