Evaluation of resist sensitivity in extreme ultravioletsoft x-ray region for next-generation lithography

Tomoko Gowa Oyama, Akihiro Oshima, Masakazu Washio, Seiichi Tagawa

Research output: Contribution to journalArticle

16 Citations (Scopus)

Abstract

At and below the 11 nm node, shortening the exposure wavelength to 10 nm (extreme ultraviolet (EUV)soft x-ray region), especially at 6.6-6.8 nm, has been discussed as next-generation EUV lithography. In this study, dosesensitivities of typical resists were obtained at several wavelengths down to 3.1 nm and were found to depend on the wavelength. However, it was confirmed that the absorbed dose, calculated from the dosesensitivity and the respective linear absorption coefficient, was almost independent of the wavelength and constant for each resist. Thus, the resist sensitivity for next-generation lithography was predicted at wavelengths < 10 nm.

Original languageEnglish
Article number042153
JournalAIP Advances
Volume1
Issue number4
DOIs
Publication statusPublished - 2011 Dec 1

ASJC Scopus subject areas

  • Physics and Astronomy(all)

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