Evaluations of low temperature bonding using Au sub-micron particles for wafer level MEMS packaging

S. Ito, T. Ogashiwa, Y. Kanehira, H. Ishida, Shuichi Shoji, Jun Mizuno

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

This paper describes wafer level vacuum packaging with sub-micron Au particles for MEMS (micro electro mechanical systems) applications. Low temperature bonding is indispensable for relevant MEMS packaging, and use of sub-micron Au particles are suitable for hermetic seal bonding. For the fabrication of hermetically sealed wafer level packaging, a base silicon wafer and a cap glass wafer were bonded at around 200°C. Before bonding, the surface of seal rings was observed with a laser microscope to investigate the effect of surface roughness for hermeticity. After bonding, bonded wafers were dipped in the hydrofluoroether for 30 min. As a result, surface flatness of Au particles contributed to achieve hermetic sealing. Double seal rings structures were also useful to realize hermetic sealing.

Original languageEnglish
Title of host publicationProceedings - International Symposium on Advanced Packaging Materials
Pages342-347
Number of pages6
DOIs
Publication statusPublished - 2011
Event2011 International Symposium on Advanced Packaging Materials, APM 2011 - Xiamen
Duration: 2011 Oct 252011 Oct 28

Other

Other2011 International Symposium on Advanced Packaging Materials, APM 2011
CityXiamen
Period11/10/2511/10/28

Fingerprint

Packaging
Seals
Hermetic seals
Container closures
Wafer bonding
Silicon wafers
Temperature
Microscopes
Surface roughness
Vacuum
Fabrication
Glass
Lasers
Hermetic

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Materials Science(all)

Cite this

Ito, S., Ogashiwa, T., Kanehira, Y., Ishida, H., Shoji, S., & Mizuno, J. (2011). Evaluations of low temperature bonding using Au sub-micron particles for wafer level MEMS packaging. In Proceedings - International Symposium on Advanced Packaging Materials (pp. 342-347). [6105749] https://doi.org/10.1109/ISAPM.2011.6105749

Evaluations of low temperature bonding using Au sub-micron particles for wafer level MEMS packaging. / Ito, S.; Ogashiwa, T.; Kanehira, Y.; Ishida, H.; Shoji, Shuichi; Mizuno, Jun.

Proceedings - International Symposium on Advanced Packaging Materials. 2011. p. 342-347 6105749.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ito, S, Ogashiwa, T, Kanehira, Y, Ishida, H, Shoji, S & Mizuno, J 2011, Evaluations of low temperature bonding using Au sub-micron particles for wafer level MEMS packaging. in Proceedings - International Symposium on Advanced Packaging Materials., 6105749, pp. 342-347, 2011 International Symposium on Advanced Packaging Materials, APM 2011, Xiamen, 11/10/25. https://doi.org/10.1109/ISAPM.2011.6105749
Ito S, Ogashiwa T, Kanehira Y, Ishida H, Shoji S, Mizuno J. Evaluations of low temperature bonding using Au sub-micron particles for wafer level MEMS packaging. In Proceedings - International Symposium on Advanced Packaging Materials. 2011. p. 342-347. 6105749 https://doi.org/10.1109/ISAPM.2011.6105749
Ito, S. ; Ogashiwa, T. ; Kanehira, Y. ; Ishida, H. ; Shoji, Shuichi ; Mizuno, Jun. / Evaluations of low temperature bonding using Au sub-micron particles for wafer level MEMS packaging. Proceedings - International Symposium on Advanced Packaging Materials. 2011. pp. 342-347
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