Evaluations of low temperature bonding using Au sub-micron particles for wafer level MEMS packaging

S. Ito, T. Ogashiwa, Y. Kanehira, H. Ishida, S. Shoji, J. Mizuno

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

This paper describes wafer level vacuum packaging with sub-micron Au particles for MEMS (micro electro mechanical systems) applications. Low temperature bonding is indispensable for relevant MEMS packaging, and use of sub-micron Au particles are suitable for hermetic seal bonding. For the fabrication of hermetically sealed wafer level packaging, a base silicon wafer and a cap glass wafer were bonded at around 200°C. Before bonding, the surface of seal rings was observed with a laser microscope to investigate the effect of surface roughness for hermeticity. After bonding, bonded wafers were dipped in the hydrofluoroether for 30 min. As a result, surface flatness of Au particles contributed to achieve hermetic sealing. Double seal rings structures were also useful to realize hermetic sealing.

Original languageEnglish
Title of host publicationAPM 2011 Proceedings - 2011 International Symposium on Advanced Packaging Materials
Pages342-347
Number of pages6
DOIs
Publication statusPublished - 2011 Dec 1
Event2011 International Symposium on Advanced Packaging Materials, APM 2011 - Xiamen, China
Duration: 2011 Oct 252011 Oct 28

Publication series

NameProceedings - International Symposium on Advanced Packaging Materials
ISSN (Print)1550-5723

Conference

Conference2011 International Symposium on Advanced Packaging Materials, APM 2011
CountryChina
CityXiamen
Period11/10/2511/10/28

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Materials Science(all)

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  • Cite this

    Ito, S., Ogashiwa, T., Kanehira, Y., Ishida, H., Shoji, S., & Mizuno, J. (2011). Evaluations of low temperature bonding using Au sub-micron particles for wafer level MEMS packaging. In APM 2011 Proceedings - 2011 International Symposium on Advanced Packaging Materials (pp. 342-347). [6105749] (Proceedings - International Symposium on Advanced Packaging Materials). https://doi.org/10.1109/ISAPM.2011.6105749