Evidence for "superfilling" of submicrometer trenches with electroless copper deposit

Madoka Hasegawa, Noriyuki Yamachika, Yosi Shacham-Diamand, Yutaka Okinaka, Tetsuya Osaka

Research output: Contribution to journalArticle

38 Citations (Scopus)

Abstract

Void-free copper filling of trenches for ultralarge scale integrated interconnect structure was demonstrated by electroless deposition technique using polyethylene glycol as an inhibiting bath additive. With this electroless plating bath, the authors succeeded in demonstrating superfilling. Of particular interest is that the deposition at trench opening was nil during the filling process, while that at the bottom was very fast. This letter presents a demonstration and a proof of superfilling of trenches by electroless copper deposition.

Original languageEnglish
Article number101916
JournalApplied Physics Letters
Volume90
Issue number10
DOIs
Publication statusPublished - 2007

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baths
deposits
electroless deposition
copper
plating
glycols
polyethylenes
voids

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

Cite this

Evidence for "superfilling" of submicrometer trenches with electroless copper deposit. / Hasegawa, Madoka; Yamachika, Noriyuki; Shacham-Diamand, Yosi; Okinaka, Yutaka; Osaka, Tetsuya.

In: Applied Physics Letters, Vol. 90, No. 10, 101916, 2007.

Research output: Contribution to journalArticle

Hasegawa, Madoka ; Yamachika, Noriyuki ; Shacham-Diamand, Yosi ; Okinaka, Yutaka ; Osaka, Tetsuya. / Evidence for "superfilling" of submicrometer trenches with electroless copper deposit. In: Applied Physics Letters. 2007 ; Vol. 90, No. 10.
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