Experiment and Simulation of Impregnated No-Insulation REBCO Pancake Coil

So Noguchi, Katsutoshi Monma, Sadanori Iwai, Hiroshi Miyazaki, Taizo Tosaka, Shunji Nomura, Tsutomu Kurusu, Hiroshi Ueda, Atsushi Ishiyama, Shinichi Urayama, Hidenao Fukuyama

    Research output: Contribution to journalArticle

    5 Citations (Scopus)

    Abstract

    It is important to investigate the stability and behavior of an epoxy-resin-impregnated no-insulation (NI) REBCO pancake coil to implement high-field applications, such as ultra-high-field magnetic resonance imaging. We have performed sudden discharging and overcurrent tests for the impregnated NI REBCO pancake coil. From the discharging test, the contact resistivity is estimated, and it changes depending on the initial current. From the overcurrent test, the high thermal stability of the impregnated NI REBCO pancake coil is confirmed. The REBCO pancake coil is charged up to 67 A though the critical current is only 46 A, and no degradation has been found. To investigate in detail the electromagnetic behavior of an impregnated NI REBCO pancake coil, the simulation is performed by means of the partial element equivalent circuit (PEEC) model. In the sudden discharging test, the simulation results for the case of lower initial current are in good agreement with the experimental data. As can be inferred from the simulation results, the current drastically decreases from the inside of the impregnated NI REBCO pancake coil. The result of the overcurrent simulation is almost identical to the experimental one. However, since the contact resistivity is presumed to be constant in the simulation, the difference is observed in the high current region.

    Original languageEnglish
    Article number7422777
    JournalIEEE Transactions on Applied Superconductivity
    Volume26
    Issue number4
    DOIs
    Publication statusPublished - 2016 Jun 1

    Keywords

    • Epoxy resin impregnation
    • high-temperature superconducting coil
    • no-insulation technique

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Condensed Matter Physics
    • Electronic, Optical and Magnetic Materials

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  • Cite this

    Noguchi, S., Monma, K., Iwai, S., Miyazaki, H., Tosaka, T., Nomura, S., Kurusu, T., Ueda, H., Ishiyama, A., Urayama, S., & Fukuyama, H. (2016). Experiment and Simulation of Impregnated No-Insulation REBCO Pancake Coil. IEEE Transactions on Applied Superconductivity, 26(4), [7422777]. https://doi.org/10.1109/TASC.2016.2536736