This paper presents the fabrication method of 3-D Ni micromesh structures. Inverse-micromesh photoresist structures, fabricated by multiple inclined backside exposure, were used as molds for Ni electroplating. Ni micromeshes of about 3μm in diameter were realized by this method. This structure is useful for increasing the surface area of micro metal electrodes.
|Number of pages||5|
|Publication status||Published - 2004 Dec 1|
|Event||Microfabricated Systems and MEMS VII - Proceedings of the International Symposium - Honolulu, HI, United States|
Duration: 2004 Oct 3 → 2004 Oct 8
|Conference||Microfabricated Systems and MEMS VII - Proceedings of the International Symposium|
|Period||04/10/3 → 04/10/8|
ASJC Scopus subject areas