Fabrication of 3-D micromesh ni structures using electroplating

Hironobu Sato; Toshiharu Otsuka; Shuichi Shoji

Fabrication of 3-D micromesh ni structures using electroplating

Hironobu Sato^*, Toshiharu Otsuka, Shuichi Shoji

^*Corresponding author for this work

School of Fundamental Science and Engineering

Research output: Contribution to conference › Paper › peer-review

Abstract

This paper presents the fabrication method of 3-D Ni micromesh structures. Inverse-micromesh photoresist structures, fabricated by multiple inclined backside exposure, were used as molds for Ni electroplating. Ni micromeshes of about 3μm in diameter were realized by this method. This structure is useful for increasing the surface area of micro metal electrodes.

Original language	English
Pages	26-30
Number of pages	5
Publication status	Published - 2004 Dec 1
Event	Microfabricated Systems and MEMS VII - Proceedings of the International Symposium - Honolulu, HI, United States Duration: 2004 Oct 3 → 2004 Oct 8

Conference

Conference	Microfabricated Systems and MEMS VII - Proceedings of the International Symposium
Country/Territory	United States
City	Honolulu, HI
Period	04/10/3 → 04/10/8

ASJC Scopus subject areas

Engineering(all)

Cite this

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title = "Fabrication of 3-D micromesh ni structures using electroplating",

abstract = "This paper presents the fabrication method of 3-D Ni micromesh structures. Inverse-micromesh photoresist structures, fabricated by multiple inclined backside exposure, were used as molds for Ni electroplating. Ni micromeshes of about 3μm in diameter were realized by this method. This structure is useful for increasing the surface area of micro metal electrodes.",

author = "Hironobu Sato and Toshiharu Otsuka and Shuichi Shoji",

year = "2004",

month = dec,

day = "1",

language = "English",

pages = "26--30",

note = "Microfabricated Systems and MEMS VII - Proceedings of the International Symposium ; Conference date: 03-10-2004 Through 08-10-2004",

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TY - CONF

T1 - Fabrication of 3-D micromesh ni structures using electroplating

AU - Sato, Hironobu

AU - Otsuka, Toshiharu

AU - Shoji, Shuichi

PY - 2004/12/1

Y1 - 2004/12/1

N2 - This paper presents the fabrication method of 3-D Ni micromesh structures. Inverse-micromesh photoresist structures, fabricated by multiple inclined backside exposure, were used as molds for Ni electroplating. Ni micromeshes of about 3μm in diameter were realized by this method. This structure is useful for increasing the surface area of micro metal electrodes.

AB - This paper presents the fabrication method of 3-D Ni micromesh structures. Inverse-micromesh photoresist structures, fabricated by multiple inclined backside exposure, were used as molds for Ni electroplating. Ni micromeshes of about 3μm in diameter were realized by this method. This structure is useful for increasing the surface area of micro metal electrodes.

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UR - http://www.scopus.com/inward/citedby.url?scp=17044389010&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:17044389010

SP - 26

EP - 30

T2 - Microfabricated Systems and MEMS VII - Proceedings of the International Symposium

Y2 - 3 October 2004 through 8 October 2004

ER -

Fabrication of 3-D micromesh ni structures using electroplating

Abstract

Conference

ASJC Scopus subject areas

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