Fabrication of a hermetic sealing device having I-structure TGV filled with submicron gold particles

Kazuya Nomura, Akiko Okada, Shuichi Shoji, Toshinori Ogashiwa, Jun Mizuno

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We propose a hermetic sealing of a glass-to-glass structure which has an I-structure through-glass interconnect via (TGV) filled with submicron Au particles. A TGV sandwiched between two Au bumps is defined as I-structure TGV. The I-structure TGV was formed by the use of simple filling process with a resist hole and a vacuum condition. The samples were bonded at 200 °C under the vacuum of 0.50 Pa by using a low temperature Au/Au bonding pretreated with vacuum ultraviolet irradiation in the presence of oxygen gas (VUV/O3). The bonded samples showed He leakage rates of less than 5.0 × 10-9 Pa·m3 s-x1, which is the rejection limit defined by the MIL-STD-883G specification. This result indicates that proposed I-structure TGV is useful for a hermetic sealing device.

Original languageEnglish
Title of host publication2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages46-49
Number of pages4
ISBN (Print)9781467383561
DOIs
Publication statusPublished - 2015 Dec 23
Event10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Taipei, Taiwan, Province of China
Duration: 2015 Oct 212015 Oct 23

Other

Other10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015
CountryTaiwan, Province of China
CityTaipei
Period15/10/2115/10/23

Fingerprint

Gold
Fabrication
Glass
Vacuum
Hermetic
Gases
Irradiation
Oxygen
Specifications

Keywords

  • 3-D integration
  • Au-Au bonding
  • Glass-to-glass structure
  • Gold particles
  • Hermetic sealing
  • HF wet etching
  • Low temperature bonding
  • VUV/O3 treatment

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Nomura, K., Okada, A., Shoji, S., Ogashiwa, T., & Mizuno, J. (2015). Fabrication of a hermetic sealing device having I-structure TGV filled with submicron gold particles. In 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings (pp. 46-49). [7365176] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IMPACT.2015.7365176

Fabrication of a hermetic sealing device having I-structure TGV filled with submicron gold particles. / Nomura, Kazuya; Okada, Akiko; Shoji, Shuichi; Ogashiwa, Toshinori; Mizuno, Jun.

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2015. p. 46-49 7365176.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Nomura, K, Okada, A, Shoji, S, Ogashiwa, T & Mizuno, J 2015, Fabrication of a hermetic sealing device having I-structure TGV filled with submicron gold particles. in 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings., 7365176, Institute of Electrical and Electronics Engineers Inc., pp. 46-49, 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015, Taipei, Taiwan, Province of China, 15/10/21. https://doi.org/10.1109/IMPACT.2015.7365176
Nomura K, Okada A, Shoji S, Ogashiwa T, Mizuno J. Fabrication of a hermetic sealing device having I-structure TGV filled with submicron gold particles. In 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2015. p. 46-49. 7365176 https://doi.org/10.1109/IMPACT.2015.7365176
Nomura, Kazuya ; Okada, Akiko ; Shoji, Shuichi ; Ogashiwa, Toshinori ; Mizuno, Jun. / Fabrication of a hermetic sealing device having I-structure TGV filled with submicron gold particles. 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2015. pp. 46-49
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