Fabrication of a microchannel device by hot embossing and direct bonding of poly(methyl methacrylate)

Hidetoshi Shinohara, Jun Mizuno, Shuichi Shoji

Research output: Contribution to journalArticle

18 Citations (Scopus)

Abstract

We have fabricated a 50-μm-wide and a 30-μm-deep microchannel device by hot embossing and the direct bonding of poly(methyl methacrylate) (PMMA) plates with dimensions of 20 × 20 × 1 mm3 and evaluated the device's mechanical, optical, and fluidic characteristics. The device's bond strength was confirmed to be sufficiently high for practical use as well as for withstanding severe cleaning conditions, such as ultrasonic cleaning in deionized water. The optical loss around the bonded interface was also evaluated, and no increase in light absorption was observed. There was no leakage or obstacles to smooth fluidic flow when methylene blue test liquid flowed in the channel. The above results confirmed that the hot embossing and direct bonding technologies for microchannel manufacturing using PMMA plates can realize high-performance microchannel devices.

Original languageEnglish
Pages (from-to)3661-3664
Number of pages4
JournalJapanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
Volume46
Issue number6 A
DOIs
Publication statusPublished - 2007 Jun 6

Keywords

  • Direct bonding
  • Hot embossing
  • Microchannel
  • Poly(methyl methacrylate)
  • Silicon mold

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)

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