Fabrication of a microchannel device by hot embossing and direct bonding of poly(methyl methacrylate)

Hidetoshi Shinohara, Jun Mizuno, Shuichi Shoji

Research output: Contribution to journalArticle

18 Citations (Scopus)

Abstract

We have fabricated a 50-μm-wide and a 30-μm-deep microchannel device by hot embossing and the direct bonding of poly(methyl methacrylate) (PMMA) plates with dimensions of 20 × 20 × 1 mm3 and evaluated the device's mechanical, optical, and fluidic characteristics. The device's bond strength was confirmed to be sufficiently high for practical use as well as for withstanding severe cleaning conditions, such as ultrasonic cleaning in deionized water. The optical loss around the bonded interface was also evaluated, and no increase in light absorption was observed. There was no leakage or obstacles to smooth fluidic flow when methylene blue test liquid flowed in the channel. The above results confirmed that the hot embossing and direct bonding technologies for microchannel manufacturing using PMMA plates can realize high-performance microchannel devices.

Original languageEnglish
Pages (from-to)3661-3664
Number of pages4
JournalJapanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
Volume46
Issue number6 A
DOIs
Publication statusPublished - 2007 Jun 6

Fingerprint

embossing
microchannels
Microchannels
Polymethyl methacrylates
polymethyl methacrylate
fluidics
Fluidics
Fabrication
fabrication
ultrasonic cleaning
Ultrasonic cleaning
mechanical devices
Optical losses
Deionized water
methylene blue
electromagnetic absorption
Light absorption
cleaning
Cleaning
leakage

Keywords

  • Direct bonding
  • Hot embossing
  • Microchannel
  • Poly(methyl methacrylate)
  • Silicon mold

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

Cite this

@article{c124e18c1c9b49b897aef8036b489d8c,
title = "Fabrication of a microchannel device by hot embossing and direct bonding of poly(methyl methacrylate)",
abstract = "We have fabricated a 50-μm-wide and a 30-μm-deep microchannel device by hot embossing and the direct bonding of poly(methyl methacrylate) (PMMA) plates with dimensions of 20 × 20 × 1 mm3 and evaluated the device's mechanical, optical, and fluidic characteristics. The device's bond strength was confirmed to be sufficiently high for practical use as well as for withstanding severe cleaning conditions, such as ultrasonic cleaning in deionized water. The optical loss around the bonded interface was also evaluated, and no increase in light absorption was observed. There was no leakage or obstacles to smooth fluidic flow when methylene blue test liquid flowed in the channel. The above results confirmed that the hot embossing and direct bonding technologies for microchannel manufacturing using PMMA plates can realize high-performance microchannel devices.",
keywords = "Direct bonding, Hot embossing, Microchannel, Poly(methyl methacrylate), Silicon mold",
author = "Hidetoshi Shinohara and Jun Mizuno and Shuichi Shoji",
year = "2007",
month = "6",
day = "6",
doi = "10.1143/JJAP.46.3661",
language = "English",
volume = "46",
pages = "3661--3664",
journal = "Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes",
issn = "0021-4922",
publisher = "Japan Society of Applied Physics",
number = "6 A",

}

TY - JOUR

T1 - Fabrication of a microchannel device by hot embossing and direct bonding of poly(methyl methacrylate)

AU - Shinohara, Hidetoshi

AU - Mizuno, Jun

AU - Shoji, Shuichi

PY - 2007/6/6

Y1 - 2007/6/6

N2 - We have fabricated a 50-μm-wide and a 30-μm-deep microchannel device by hot embossing and the direct bonding of poly(methyl methacrylate) (PMMA) plates with dimensions of 20 × 20 × 1 mm3 and evaluated the device's mechanical, optical, and fluidic characteristics. The device's bond strength was confirmed to be sufficiently high for practical use as well as for withstanding severe cleaning conditions, such as ultrasonic cleaning in deionized water. The optical loss around the bonded interface was also evaluated, and no increase in light absorption was observed. There was no leakage or obstacles to smooth fluidic flow when methylene blue test liquid flowed in the channel. The above results confirmed that the hot embossing and direct bonding technologies for microchannel manufacturing using PMMA plates can realize high-performance microchannel devices.

AB - We have fabricated a 50-μm-wide and a 30-μm-deep microchannel device by hot embossing and the direct bonding of poly(methyl methacrylate) (PMMA) plates with dimensions of 20 × 20 × 1 mm3 and evaluated the device's mechanical, optical, and fluidic characteristics. The device's bond strength was confirmed to be sufficiently high for practical use as well as for withstanding severe cleaning conditions, such as ultrasonic cleaning in deionized water. The optical loss around the bonded interface was also evaluated, and no increase in light absorption was observed. There was no leakage or obstacles to smooth fluidic flow when methylene blue test liquid flowed in the channel. The above results confirmed that the hot embossing and direct bonding technologies for microchannel manufacturing using PMMA plates can realize high-performance microchannel devices.

KW - Direct bonding

KW - Hot embossing

KW - Microchannel

KW - Poly(methyl methacrylate)

KW - Silicon mold

UR - http://www.scopus.com/inward/record.url?scp=34547850210&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=34547850210&partnerID=8YFLogxK

U2 - 10.1143/JJAP.46.3661

DO - 10.1143/JJAP.46.3661

M3 - Article

VL - 46

SP - 3661

EP - 3664

JO - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

JF - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

SN - 0021-4922

IS - 6 A

ER -