Abstract
Utilizing micromachining based on a semiconductor device fabrication technique, a miniature pump (micropump) was fabricated on a silicon substrate. The purpose is to integrate a conventional chemical analyzing system on an Si substrate by using microchemical sensors such as ISFET's and microvalves. The micropump was the diaphragm type. The pump was composed of an inlet and outlet having a one-way microvalve, a pressure chamber formed on an Si substrate and a miniature piezoactuator. The size of the pump was 8 mm × 10 mm × 10 mm and the flow rate on the order of μl/min could easily be controlled by the voltage signal applied to the actuator. To monitor the flow of the pump, a differential pressure sensor which could be formed on the Si substrate was developed. The sensor was composed of a one-way valve and a piezoresistive diaphragm-type pressure sensor, and had a high sensitivity to small flow.
| Original language | English |
|---|---|
| Pages (from-to) | 52-59 |
| Number of pages | 8 |
| Journal | Electronics and Communications in Japan, Part II: Electronics (English translation of Denshi Tsushin Gakkai Ronbunshi) |
| Volume | 72 |
| Issue number | 10 |
| Publication status | Published - 1989 Oct |
| Externally published | Yes |
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ASJC Scopus subject areas
- Electrical and Electronic Engineering
Cite this
Fabrication of a micropump for integrated chemical analyzing systems. / Shoji, Shuichi; Esashi, Masayoshi.
In: Electronics and Communications in Japan, Part II: Electronics (English translation of Denshi Tsushin Gakkai Ronbunshi), Vol. 72, No. 10, 10.1989, p. 52-59.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Fabrication of a micropump for integrated chemical analyzing systems
AU - Shoji, Shuichi
AU - Esashi, Masayoshi
PY - 1989/10
Y1 - 1989/10
N2 - Utilizing micromachining based on a semiconductor device fabrication technique, a miniature pump (micropump) was fabricated on a silicon substrate. The purpose is to integrate a conventional chemical analyzing system on an Si substrate by using microchemical sensors such as ISFET's and microvalves. The micropump was the diaphragm type. The pump was composed of an inlet and outlet having a one-way microvalve, a pressure chamber formed on an Si substrate and a miniature piezoactuator. The size of the pump was 8 mm × 10 mm × 10 mm and the flow rate on the order of μl/min could easily be controlled by the voltage signal applied to the actuator. To monitor the flow of the pump, a differential pressure sensor which could be formed on the Si substrate was developed. The sensor was composed of a one-way valve and a piezoresistive diaphragm-type pressure sensor, and had a high sensitivity to small flow.
AB - Utilizing micromachining based on a semiconductor device fabrication technique, a miniature pump (micropump) was fabricated on a silicon substrate. The purpose is to integrate a conventional chemical analyzing system on an Si substrate by using microchemical sensors such as ISFET's and microvalves. The micropump was the diaphragm type. The pump was composed of an inlet and outlet having a one-way microvalve, a pressure chamber formed on an Si substrate and a miniature piezoactuator. The size of the pump was 8 mm × 10 mm × 10 mm and the flow rate on the order of μl/min could easily be controlled by the voltage signal applied to the actuator. To monitor the flow of the pump, a differential pressure sensor which could be formed on the Si substrate was developed. The sensor was composed of a one-way valve and a piezoresistive diaphragm-type pressure sensor, and had a high sensitivity to small flow.
UR - http://www.scopus.com/inward/record.url?scp=0024753128&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=0024753128&partnerID=8YFLogxK
M3 - Article
AN - SCOPUS:0024753128
VL - 72
SP - 52
EP - 59
JO - Electronics and Communications in Japan, Part II: Electronics (English translation of Denshi Tsushin Gakkai Ronbunshi)
JF - Electronics and Communications in Japan, Part II: Electronics (English translation of Denshi Tsushin Gakkai Ronbunshi)
SN - 8756-663X
IS - 10
ER -