TY - GEN
T1 - Fabrication of AFM probe with CuO nanowire formed by stress-induced method
AU - Hosoi, Atsushi
AU - Koto, Hisataka
AU - Ju, Yang
PY - 2013/9/2
Y1 - 2013/9/2
N2 - A novel method to fabricate an atomic force microscope (AFM) probe with CuO nanowire was proposed using a stress-induced method which can form nanowire easily. By heating a commercial AFM probe which is eliminated its tip and is coated with Ta and Cu films, Cu hillock and CuO nanowires on the hillock can be formed at the probe end. To obtain the CuO nanowire of high aspect ratio that can use as an AFM probe tip, thickness of coating films, heating temperature and heating time were investigated. As the result, the probe tip approximately 5 μm high and the nanowire approximately 25 nm in diameter were successfully obtained. In the results that the measurement resolution was evaluated, the measurement resolution of the CuO nanowire probe slightly worse than that of a commercial AFM probe. However, from the viewpoint of the dimensional measurement, the precision was almost equal between both probes.
AB - A novel method to fabricate an atomic force microscope (AFM) probe with CuO nanowire was proposed using a stress-induced method which can form nanowire easily. By heating a commercial AFM probe which is eliminated its tip and is coated with Ta and Cu films, Cu hillock and CuO nanowires on the hillock can be formed at the probe end. To obtain the CuO nanowire of high aspect ratio that can use as an AFM probe tip, thickness of coating films, heating temperature and heating time were investigated. As the result, the probe tip approximately 5 μm high and the nanowire approximately 25 nm in diameter were successfully obtained. In the results that the measurement resolution was evaluated, the measurement resolution of the CuO nanowire probe slightly worse than that of a commercial AFM probe. However, from the viewpoint of the dimensional measurement, the precision was almost equal between both probes.
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M3 - Conference contribution
AN - SCOPUS:84883115343
SN - 9781467344777
T3 - 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013
BT - 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013
T2 - 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013
Y2 - 16 April 2013 through 18 April 2013
ER -