Fabrication of bottom-emitting organic light-emitting diode panels interconnected with encapsulation substrate by Au-Au flip-chip bonding and capillary-driven filling process

S. Yamada, C. H. Shim, T. Edura, A. Okada, C. Adachi, Shuichi Shoji, Jun Mizuno

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

We present fabrication and testing of bottom-emitting organic light-emitting diode (OLED) panels based on flip-chip assembly and non-destructive scanning. In this method, the OLED and electric circuits are fabricated on separate substrates and interconnected by low temperature assembly to create a high-performance bottom-emitting OLED including other functions such as thin-film transistor (TFT) circuits. The low temperature assembly process consists of two steps. First, an OLED substrate and encapsulation glass with circuits are bonded at 100 °C via Au-Au bond. Encapsulation glass is utilized for the functional substrate with circuits. Next, the bonded panel is sealed by capillary underfill within and by applying and curing seal materials to the panel edge. The fabricated OLED was non-destructively evaluated by scanning acoustic microscopy (SAM). The SAM image shows all φ500 μm Au bumps were bonded to Au pads, indicating that OLED and encapsulation substrates were assembled. Electroluminescence of the OLED was demonstrated by applying voltage. Stable current-luminance characteristics were obtained for the fabricated OLED with an operating voltage of 3.25 V. The results indicate that the proposed fabrication is available for bottom-emitting OLED controlled by TFT circuits. In future, the assembly process can be widely applied to other flexible organic electronic devices with roll assembly by altering OLED or circuits with other devices because this is a simple pressure method with low temperature, achieving encapsulation at same time.

Original languageEnglish
Pages (from-to)94-97
Number of pages4
JournalMicroelectronic Engineering
Volume161
DOIs
Publication statusPublished - 2016 Aug 1

Fingerprint

Organic light emitting diodes (OLED)
Encapsulation
light emitting diodes
chips
Fabrication
fabrication
Substrates
assembly
Networks (circuits)
transistor circuits
Thin film transistors
scanning
microscopy
Glass
acoustics
glass
Electroluminescence
Electric potential
electric potential
thin films

Keywords

  • Active-matrix organic-light-emitting diode (AMOLED)
  • Capillary-driven filling
  • Encapsulation
  • Flip-chip assembly
  • Low temperature Au-Au bonding
  • Wafer bonding

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics

Cite this

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title = "Fabrication of bottom-emitting organic light-emitting diode panels interconnected with encapsulation substrate by Au-Au flip-chip bonding and capillary-driven filling process",
abstract = "We present fabrication and testing of bottom-emitting organic light-emitting diode (OLED) panels based on flip-chip assembly and non-destructive scanning. In this method, the OLED and electric circuits are fabricated on separate substrates and interconnected by low temperature assembly to create a high-performance bottom-emitting OLED including other functions such as thin-film transistor (TFT) circuits. The low temperature assembly process consists of two steps. First, an OLED substrate and encapsulation glass with circuits are bonded at 100 °C via Au-Au bond. Encapsulation glass is utilized for the functional substrate with circuits. Next, the bonded panel is sealed by capillary underfill within and by applying and curing seal materials to the panel edge. The fabricated OLED was non-destructively evaluated by scanning acoustic microscopy (SAM). The SAM image shows all φ500 μm Au bumps were bonded to Au pads, indicating that OLED and encapsulation substrates were assembled. Electroluminescence of the OLED was demonstrated by applying voltage. Stable current-luminance characteristics were obtained for the fabricated OLED with an operating voltage of 3.25 V. The results indicate that the proposed fabrication is available for bottom-emitting OLED controlled by TFT circuits. In future, the assembly process can be widely applied to other flexible organic electronic devices with roll assembly by altering OLED or circuits with other devices because this is a simple pressure method with low temperature, achieving encapsulation at same time.",
keywords = "Active-matrix organic-light-emitting diode (AMOLED), Capillary-driven filling, Encapsulation, Flip-chip assembly, Low temperature Au-Au bonding, Wafer bonding",
author = "S. Yamada and Shim, {C. H.} and T. Edura and A. Okada and C. Adachi and Shuichi Shoji and Jun Mizuno",
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T1 - Fabrication of bottom-emitting organic light-emitting diode panels interconnected with encapsulation substrate by Au-Au flip-chip bonding and capillary-driven filling process

AU - Yamada, S.

AU - Shim, C. H.

AU - Edura, T.

AU - Okada, A.

AU - Adachi, C.

AU - Shoji, Shuichi

AU - Mizuno, Jun

PY - 2016/8/1

Y1 - 2016/8/1

N2 - We present fabrication and testing of bottom-emitting organic light-emitting diode (OLED) panels based on flip-chip assembly and non-destructive scanning. In this method, the OLED and electric circuits are fabricated on separate substrates and interconnected by low temperature assembly to create a high-performance bottom-emitting OLED including other functions such as thin-film transistor (TFT) circuits. The low temperature assembly process consists of two steps. First, an OLED substrate and encapsulation glass with circuits are bonded at 100 °C via Au-Au bond. Encapsulation glass is utilized for the functional substrate with circuits. Next, the bonded panel is sealed by capillary underfill within and by applying and curing seal materials to the panel edge. The fabricated OLED was non-destructively evaluated by scanning acoustic microscopy (SAM). The SAM image shows all φ500 μm Au bumps were bonded to Au pads, indicating that OLED and encapsulation substrates were assembled. Electroluminescence of the OLED was demonstrated by applying voltage. Stable current-luminance characteristics were obtained for the fabricated OLED with an operating voltage of 3.25 V. The results indicate that the proposed fabrication is available for bottom-emitting OLED controlled by TFT circuits. In future, the assembly process can be widely applied to other flexible organic electronic devices with roll assembly by altering OLED or circuits with other devices because this is a simple pressure method with low temperature, achieving encapsulation at same time.

AB - We present fabrication and testing of bottom-emitting organic light-emitting diode (OLED) panels based on flip-chip assembly and non-destructive scanning. In this method, the OLED and electric circuits are fabricated on separate substrates and interconnected by low temperature assembly to create a high-performance bottom-emitting OLED including other functions such as thin-film transistor (TFT) circuits. The low temperature assembly process consists of two steps. First, an OLED substrate and encapsulation glass with circuits are bonded at 100 °C via Au-Au bond. Encapsulation glass is utilized for the functional substrate with circuits. Next, the bonded panel is sealed by capillary underfill within and by applying and curing seal materials to the panel edge. The fabricated OLED was non-destructively evaluated by scanning acoustic microscopy (SAM). The SAM image shows all φ500 μm Au bumps were bonded to Au pads, indicating that OLED and encapsulation substrates were assembled. Electroluminescence of the OLED was demonstrated by applying voltage. Stable current-luminance characteristics were obtained for the fabricated OLED with an operating voltage of 3.25 V. The results indicate that the proposed fabrication is available for bottom-emitting OLED controlled by TFT circuits. In future, the assembly process can be widely applied to other flexible organic electronic devices with roll assembly by altering OLED or circuits with other devices because this is a simple pressure method with low temperature, achieving encapsulation at same time.

KW - Active-matrix organic-light-emitting diode (AMOLED)

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KW - Encapsulation

KW - Flip-chip assembly

KW - Low temperature Au-Au bonding

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