Fabrication of bottom-emitting organic light-emitting diode panels interconnected with encapsulation substrate by Au-Au flip-chip bonding and capillary-driven filling process

S. Yamada, C. H. Shim, T. Edura, A. Okada, C. Adachi, S. Shoji, J. Mizuno

Research output: Contribution to journalArticlepeer-review

3 Citations (Scopus)

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Chemical Compounds

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