Fabrication of built-in copper microstructures on epoxy resin

Shuichi Asakura, Shuhei Fukutani, Akio Fuwa

    Research output: Contribution to journalArticle

    8 Citations (Scopus)

    Abstract

    This paper describes a simple and effective method to fabricate built-in copper microstructures on a polymer substrate. Our method uses a micropatterned amino (NH2)-terminated self-assembled monolayer (SAM) as a template to fabricate patterned copper (Cu) film for transfer to an epoxy resin. Cu microstructures were first formed on a photolithographically micropatterned NH2-SAM-covered SiO2/Si substrate through conventional electroless plating, in which Cu deposition proceeded selectively on the NH 2-terminated areas while the photo-irradiated areas remained free of copper deposits. Next, epoxy glue (resin) was poured into a Teflon® O-ring placed so as to surround the Cu-micropatterned substrate. Finally, after the resin completely hardened, it was removed from the substrate. Due to the weak adhesion between the Cu film and the NH2-terminated surface, the area-selectively deposited Cu film could be readily peeled off and removed from the SiO2/Si substrate and thus transferred to the resin surface. Through this technique, high-resolution 10-μm-wide Cu microstructures were successfully fabricated on the epoxy resin surface. These embedded Cu microstructures were tightly adhered to the resin. No peeling of the copper structures was observed in a Scotch® tape peeling test.

    Original languageEnglish
    Pages (from-to)375-382
    Number of pages8
    JournalMicroelectronic Engineering
    Volume75
    Issue number4
    DOIs
    Publication statusPublished - 2004 Nov

    Fingerprint

    Epoxy Resins
    epoxy resins
    Epoxy resins
    Copper
    resins
    Fabrication
    copper
    Resins
    microstructure
    Microstructure
    fabrication
    Substrates
    peeling
    Peeling
    Self assembled monolayers
    Copper deposits
    O rings
    glues
    Glues
    Electroless plating

    Keywords

    • Copper
    • Electroless plating
    • Microstructure
    • Self-assembled monolayer
    • Transfer
    • Vacuum ultraviolet

    ASJC Scopus subject areas

    • Hardware and Architecture
    • Electrical and Electronic Engineering
    • Electronic, Optical and Magnetic Materials
    • Surfaces, Coatings and Films
    • Atomic and Molecular Physics, and Optics

    Cite this

    Fabrication of built-in copper microstructures on epoxy resin. / Asakura, Shuichi; Fukutani, Shuhei; Fuwa, Akio.

    In: Microelectronic Engineering, Vol. 75, No. 4, 11.2004, p. 375-382.

    Research output: Contribution to journalArticle

    Asakura, Shuichi ; Fukutani, Shuhei ; Fuwa, Akio. / Fabrication of built-in copper microstructures on epoxy resin. In: Microelectronic Engineering. 2004 ; Vol. 75, No. 4. pp. 375-382.
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