Fabrication of high-density copper microstructures using vacuum ultraviolet light lithography and hydrofluoric acid etching treatment

S. Asakura, A. Hozumi, Tadashi Yamaguchi, A. Fuwa

    Research output: Contribution to journalArticle

    5 Citations (Scopus)

    Abstract

    This paper describes a method to fabricate high-density copper microstructures on an indium tin oxide (ITO) surface. Lithography using 172-nm vacuum ultraviolet (VUV) light was found to not decompose the siloxane network at the bottom of a methyl-terminated organosilane self-assembled monolayer (SAM) deposited on an ITO substrate. When copper was electrodeposited onto this ITO surface covered a SAM/siloxane network pattern, it deposited selectively onto the siloxane regions. However, the density of the electrodeposited copper was low. By applying a wet hydrofluoric (HF) acid treatment for an appropriate time after the lithography, we could effectively remove the siloxane network without damaging the organosilane SAM. In this manner, we were able to successfully fabricate high-density copper microstructures with 35×35 μm2 patterns.

    Original languageEnglish
    Pages (from-to)127-132
    Number of pages6
    JournalThin Solid Films
    Volume467
    Issue number1-2
    DOIs
    Publication statusPublished - 2004 Nov 22

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    Keywords

    • Copper
    • Etching
    • Self-assembled monolayer
    • Siloxane network

    ASJC Scopus subject areas

    • Surfaces, Coatings and Films
    • Condensed Matter Physics
    • Surfaces and Interfaces

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