Fabrication of highly dimension controlled PMMA microchip by hot embossing and low temperature direct bonding

Hidetoshi Shinohara, Jun Mizuno, Fumihiko Kitagawa, Koji Otsuka, Shuichi Shoji

Research output: Contribution to conferencePaper

3 Citations (Scopus)

Abstract

In this paper, a PMMA (poly-methyl methacrylate) microchip, which has shallow dams of about 5 μm gaps, was fabricated and evaluated. Accurate dimension control of the micro-channels was realized by not only optimizing hot embossing conditions but also employing low temperature plasma activated bonding.

Original languageEnglish
Pages158-160
Number of pages3
Publication statusPublished - 2006 Jan 1
Event10th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2006 - Tokyo, Japan
Duration: 2006 Nov 52006 Nov 9

Conference

Conference10th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2006
CountryJapan
CityTokyo
Period06/11/506/11/9

Keywords

  • Hot embossing
  • Polymer microchip
  • Surface activation bonding

ASJC Scopus subject areas

  • Chemical Engineering (miscellaneous)
  • Bioengineering

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  • Cite this

    Shinohara, H., Mizuno, J., Kitagawa, F., Otsuka, K., & Shoji, S. (2006). Fabrication of highly dimension controlled PMMA microchip by hot embossing and low temperature direct bonding. 158-160. Paper presented at 10th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2006, Tokyo, Japan.