Fabrication of microchannel-TEM grid for in situ liquid observation of interfacial chemical reaction

K. Miwa, Hiroyuki Kuwae, K. Sakamoto, Shuichi Shoji, Jun Mizuno

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We developed a novel microchannel-TEM grid that enables observation of interfacial biochemical reactions. A Y-shaped microchannel, which was sandwiched between two alumina membranes, realizes observation of interfacial reactions by lamellar flow. Reliable sealing of the microchannel was achieved by highly stable Al2O3/SU-8 bonding of 2.90 MPa at 180 °C. TEM images indicate the TEM grid has sufficient electron transparency and it was successfully fabricated without microchannel distortion. These results suggest that proposed TEM grid will become a powerful tool for revealing mechanisms of chemical reactions.

Original languageEnglish
Title of host publication2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages284-287
Number of pages4
ISBN (Electronic)9784990218850
DOIs
Publication statusPublished - 2018 Jun 6
Event2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018 - Kuwana, Mie, Japan
Duration: 2018 Apr 172018 Apr 21

Other

Other2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018
CountryJapan
CityKuwana, Mie
Period18/4/1718/4/21

Keywords

  • interfacial chemical reaction
  • liquid phase observation
  • TEM grid

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Polymers and Plastics

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  • Cite this

    Miwa, K., Kuwae, H., Sakamoto, K., Shoji, S., & Mizuno, J. (2018). Fabrication of microchannel-TEM grid for in situ liquid observation of interfacial chemical reaction. In 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018 (pp. 284-287). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/ICEP.2018.8374305