Fabrication of microstructured copper on an indium-tin-oxide surface using a micropatterned self-assembled monolayer as a template

Shuuichi Asakura, Mitsuhito Hirota, Akio Fuwa

    Research output: Contribution to journalArticle

    9 Citations (Scopus)

    Abstract

    An ODS-SAM was successfully formed onto an ITO surface by CVD. The originally hydrophilic surface became highly hydrophobic with maximum water-contact angle reaching about 120°C. The final contact angles of the ODS-SAMs depended significantly on CVD temperature and treatment time. The surface hydrophobicity of ODS-SAM samples deposited at 100 and 150°C was superior to that of a sample treated at 50°C. It was determined that the CVD temperature of 150°C is optimum for ODS-SAM preparation.

    Original languageEnglish
    Pages (from-to)1152-1156
    Number of pages5
    JournalJournal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
    Volume21
    Issue number4
    DOIs
    Publication statusPublished - 2003 Jul

    Fingerprint

    Self assembled monolayers
    Tin oxides
    indium oxides
    Indium
    tin oxides
    Copper
    Chemical vapor deposition
    templates
    vapor deposition
    Fabrication
    copper
    fabrication
    Contact angle
    Hydrophobicity
    hydrophobicity
    ITO (semiconductors)
    Temperature
    preparation
    temperature
    Water

    ASJC Scopus subject areas

    • Surfaces, Coatings and Films
    • Surfaces and Interfaces
    • Physics and Astronomy (miscellaneous)

    Cite this

    Fabrication of microstructured copper on an indium-tin-oxide surface using a micropatterned self-assembled monolayer as a template. / Asakura, Shuuichi; Hirota, Mitsuhito; Fuwa, Akio.

    In: Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films, Vol. 21, No. 4, 07.2003, p. 1152-1156.

    Research output: Contribution to journalArticle

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