Fabrication of microstructured copper on an indium-tin-oxide surface using a micropatterned self-assembled monolayer as a template

Shuuichi Asakura; Mitsuhito Hirota; Akio Fuwa

doi:10.1116/1.1584037

Fabrication of microstructured copper on an indium-tin-oxide surface using a micropatterned self-assembled monolayer as a template

Shuuichi Asakura, Mitsuhito Hirota, Akio Fuwa

Research output: Contribution to journal › Article › peer-review

9 Citations (Scopus)

Abstract

An ODS-SAM was successfully formed onto an ITO surface by CVD. The originally hydrophilic surface became highly hydrophobic with maximum water-contact angle reaching about 120°C. The final contact angles of the ODS-SAMs depended significantly on CVD temperature and treatment time. The surface hydrophobicity of ODS-SAM samples deposited at 100 and 150°C was superior to that of a sample treated at 50°C. It was determined that the CVD temperature of 150°C is optimum for ODS-SAM preparation.

Original language	English
Pages (from-to)	1152-1156
Number of pages	5
Journal	Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Volume	21
Issue number	4
DOIs	https://doi.org/10.1116/1.1584037
Publication status	Published - 2003 Jul

ASJC Scopus subject areas

Surfaces, Coatings and Films
Surfaces and Interfaces
Physics and Astronomy (miscellaneous)

Access to Document

10.1116/1.1584037

Fingerprint Dive into the research topics of 'Fabrication of microstructured copper on an indium-tin-oxide surface using a micropatterned self-assembled monolayer as a template'. Together they form a unique fingerprint.

Cite this

@article{dfe5dd955efe4aaaaf656004f139d35c,

title = "Fabrication of microstructured copper on an indium-tin-oxide surface using a micropatterned self-assembled monolayer as a template",

abstract = "An ODS-SAM was successfully formed onto an ITO surface by CVD. The originally hydrophilic surface became highly hydrophobic with maximum water-contact angle reaching about 120°C. The final contact angles of the ODS-SAMs depended significantly on CVD temperature and treatment time. The surface hydrophobicity of ODS-SAM samples deposited at 100 and 150°C was superior to that of a sample treated at 50°C. It was determined that the CVD temperature of 150°C is optimum for ODS-SAM preparation.",

author = "Shuuichi Asakura and Mitsuhito Hirota and Akio Fuwa",

year = "2003",

month = jul,

doi = "10.1116/1.1584037",

language = "English",

volume = "21",

pages = "1152--1156",

journal = "Journal of Vacuum Science and Technology A",

issn = "0734-2101",

publisher = "AVS Science and Technology Society",

number = "4",

}

TY - JOUR

T1 - Fabrication of microstructured copper on an indium-tin-oxide surface using a micropatterned self-assembled monolayer as a template

AU - Asakura, Shuuichi

AU - Hirota, Mitsuhito

AU - Fuwa, Akio

PY - 2003/7

Y1 - 2003/7

N2 - An ODS-SAM was successfully formed onto an ITO surface by CVD. The originally hydrophilic surface became highly hydrophobic with maximum water-contact angle reaching about 120°C. The final contact angles of the ODS-SAMs depended significantly on CVD temperature and treatment time. The surface hydrophobicity of ODS-SAM samples deposited at 100 and 150°C was superior to that of a sample treated at 50°C. It was determined that the CVD temperature of 150°C is optimum for ODS-SAM preparation.

AB - An ODS-SAM was successfully formed onto an ITO surface by CVD. The originally hydrophilic surface became highly hydrophobic with maximum water-contact angle reaching about 120°C. The final contact angles of the ODS-SAMs depended significantly on CVD temperature and treatment time. The surface hydrophobicity of ODS-SAM samples deposited at 100 and 150°C was superior to that of a sample treated at 50°C. It was determined that the CVD temperature of 150°C is optimum for ODS-SAM preparation.

UR - http://www.scopus.com/inward/record.url?scp=0042030863&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0042030863&partnerID=8YFLogxK

U2 - 10.1116/1.1584037

DO - 10.1116/1.1584037

M3 - Article

AN - SCOPUS:0042030863

VL - 21

SP - 1152

EP - 1156

JO - Journal of Vacuum Science and Technology A

JF - Journal of Vacuum Science and Technology A

SN - 0734-2101

IS - 4

ER -