Fabrication of multilayer interconnection using ultraviolet nanoimprint lithography

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Advanced large scale integrated circuits (LSI) and smart sensor systems require nanoscale interconnection to transmit signals. In this work, an approach to realize multilayer interconnection based on ultraviolet nanoimprint lithography (UV-NIL) technology and copper electroplating is discussed. UV-NIL is a low-cost, mass-production technology. Nanoscale dot array patterns and line array patterns of nickel and copper were formed on a silicon substrate using UV-NIL in combination with electroplating. Imprinted 220 nm hole patterns and 150 nm line patterns were formed on photocurable resin with high dimensional accuracy. Using these resin patterns as a mask layer, 245 nm metal dot and 195 nm metal line array patterns were successfully fabricated by electroplating.

Original languageEnglish
Title of host publication4th International Conference on Networked Sensing Systems, INSS
Pages130-133
Number of pages4
DOIs
Publication statusPublished - 2007
Event4th International Conference on Networked Sensing Systems, INSS - Braunschweig
Duration: 2007 Jun 62007 Jun 8

Other

Other4th International Conference on Networked Sensing Systems, INSS
CityBraunschweig
Period07/6/607/6/8

Fingerprint

Nanoimprint lithography
Electroplating
Multilayers
Fabrication
Resins
Copper
Smart sensors
Metals
Integrated circuits
Masks
Nickel
Silicon
Substrates
Costs

Keywords

  • Copper electroplating
  • Multilayer interconnection
  • Nanodot
  • Nanoline
  • Ultraviolet nanoimprint lithography (UV-NIL)

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Control and Systems Engineering

Cite this

Ono, H., Shoji, S., Mizuno, J., & Saito, M. (2007). Fabrication of multilayer interconnection using ultraviolet nanoimprint lithography. In 4th International Conference on Networked Sensing Systems, INSS (pp. 130-133). [4297406] https://doi.org/10.1109/INSS.2007.4297406

Fabrication of multilayer interconnection using ultraviolet nanoimprint lithography. / Ono, Hiroshi; Shoji, Shuichi; Mizuno, Jun; Saito, Mikiko.

4th International Conference on Networked Sensing Systems, INSS. 2007. p. 130-133 4297406.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ono, H, Shoji, S, Mizuno, J & Saito, M 2007, Fabrication of multilayer interconnection using ultraviolet nanoimprint lithography. in 4th International Conference on Networked Sensing Systems, INSS., 4297406, pp. 130-133, 4th International Conference on Networked Sensing Systems, INSS, Braunschweig, 07/6/6. https://doi.org/10.1109/INSS.2007.4297406
Ono H, Shoji S, Mizuno J, Saito M. Fabrication of multilayer interconnection using ultraviolet nanoimprint lithography. In 4th International Conference on Networked Sensing Systems, INSS. 2007. p. 130-133. 4297406 https://doi.org/10.1109/INSS.2007.4297406
Ono, Hiroshi ; Shoji, Shuichi ; Mizuno, Jun ; Saito, Mikiko. / Fabrication of multilayer interconnection using ultraviolet nanoimprint lithography. 4th International Conference on Networked Sensing Systems, INSS. 2007. pp. 130-133
@inproceedings{b3d8f56575294de99aa7c19c71c03b6b,
title = "Fabrication of multilayer interconnection using ultraviolet nanoimprint lithography",
abstract = "Advanced large scale integrated circuits (LSI) and smart sensor systems require nanoscale interconnection to transmit signals. In this work, an approach to realize multilayer interconnection based on ultraviolet nanoimprint lithography (UV-NIL) technology and copper electroplating is discussed. UV-NIL is a low-cost, mass-production technology. Nanoscale dot array patterns and line array patterns of nickel and copper were formed on a silicon substrate using UV-NIL in combination with electroplating. Imprinted 220 nm hole patterns and 150 nm line patterns were formed on photocurable resin with high dimensional accuracy. Using these resin patterns as a mask layer, 245 nm metal dot and 195 nm metal line array patterns were successfully fabricated by electroplating.",
keywords = "Copper electroplating, Multilayer interconnection, Nanodot, Nanoline, Ultraviolet nanoimprint lithography (UV-NIL)",
author = "Hiroshi Ono and Shuichi Shoji and Jun Mizuno and Mikiko Saito",
year = "2007",
doi = "10.1109/INSS.2007.4297406",
language = "English",
isbn = "1424412315",
pages = "130--133",
booktitle = "4th International Conference on Networked Sensing Systems, INSS",

}

TY - GEN

T1 - Fabrication of multilayer interconnection using ultraviolet nanoimprint lithography

AU - Ono, Hiroshi

AU - Shoji, Shuichi

AU - Mizuno, Jun

AU - Saito, Mikiko

PY - 2007

Y1 - 2007

N2 - Advanced large scale integrated circuits (LSI) and smart sensor systems require nanoscale interconnection to transmit signals. In this work, an approach to realize multilayer interconnection based on ultraviolet nanoimprint lithography (UV-NIL) technology and copper electroplating is discussed. UV-NIL is a low-cost, mass-production technology. Nanoscale dot array patterns and line array patterns of nickel and copper were formed on a silicon substrate using UV-NIL in combination with electroplating. Imprinted 220 nm hole patterns and 150 nm line patterns were formed on photocurable resin with high dimensional accuracy. Using these resin patterns as a mask layer, 245 nm metal dot and 195 nm metal line array patterns were successfully fabricated by electroplating.

AB - Advanced large scale integrated circuits (LSI) and smart sensor systems require nanoscale interconnection to transmit signals. In this work, an approach to realize multilayer interconnection based on ultraviolet nanoimprint lithography (UV-NIL) technology and copper electroplating is discussed. UV-NIL is a low-cost, mass-production technology. Nanoscale dot array patterns and line array patterns of nickel and copper were formed on a silicon substrate using UV-NIL in combination with electroplating. Imprinted 220 nm hole patterns and 150 nm line patterns were formed on photocurable resin with high dimensional accuracy. Using these resin patterns as a mask layer, 245 nm metal dot and 195 nm metal line array patterns were successfully fabricated by electroplating.

KW - Copper electroplating

KW - Multilayer interconnection

KW - Nanodot

KW - Nanoline

KW - Ultraviolet nanoimprint lithography (UV-NIL)

UR - http://www.scopus.com/inward/record.url?scp=47149111606&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=47149111606&partnerID=8YFLogxK

U2 - 10.1109/INSS.2007.4297406

DO - 10.1109/INSS.2007.4297406

M3 - Conference contribution

SN - 1424412315

SN - 9781424412310

SP - 130

EP - 133

BT - 4th International Conference on Networked Sensing Systems, INSS

ER -