Abstract
This paper presents the fabrication methods of polymer and metal three-dimensional (3-D) micromesh structures. The photoresist micromesh structures were formed using multiple inclined UV exposure from the backside of the SU-8 coated glass substrate with metal patterns. A few micrometer-size pillars and pores were realized by optimizing the UV lithography conditions. The 3-D macroporous-mesh Ni structures were also fabricated using electroplating. The inverse-mesh photoresist structures, fabricated by multiple inclined backside exposure, were used as molds for Ni electroplating. Ni meshes of about 3 μm in diameter were obtained by this method.
Original language | English |
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Pages (from-to) | 8341-8344 |
Number of pages | 4 |
Journal | Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers |
Volume | 43 |
Issue number | 12 |
DOIs | |
Publication status | Published - 2004 Dec |
Keywords
- 3-D micromesh structures
- Electroplating
- Multiple inclined UV exposure
- Photoresist molds
- SU-8
ASJC Scopus subject areas
- Engineering(all)
- Physics and Astronomy(all)