Fabrication of silicon mold for thermal nanoimprint lithography

J. Matsui; H. Takahashi; N. Xie; J. Mizuno; K. Utaka

doi:10.1109/INOW.2008.4634540

Fabrication of silicon mold for thermal nanoimprint lithography

J. Matsui^*, H. Takahashi, N. Xie, J. Mizuno, K. Utaka

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

We fabricated a silicon mold for thermal Nanoimprint Lithography (NIL) with EB exposure and Deep-RIE. As a result, we obtained that including a grating whose pitch was 230nm with low roughness.

Original language	English
Title of host publication	2008 Int. Nano-Optoelectronics Workshop, iNOW 2008 in Cooperation With Int. Global-COE Summer School (Photonics Integration-Core Electronics
Subtitle of host publication	PICE) and 31st Int. Symposium on Optical Communications
Pages	267-268
Number of pages	2
DOIs	https://doi.org/10.1109/INOW.2008.4634540
Publication status	Published - 2008
Event	2008 International Nano-Optoelectronics Workshop, iNOW 2008 in Cooperation With International Global-COE Summer School (Photonics Integration-Core Electronics: PICE) and 31st International Symposium on Optical Communications - Tokyo, Lake Saiko, Shanon Village, Japan Duration: 2008 Aug 2 → 2008 Aug 15

Publication series

Name	2008 Int. Nano-Optoelectronics Workshop, iNOW 2008 in Cooperation With Int. Global-COE Summer School (Photonics Integration-Core Electronics: PICE) and 31st Int. Symposium on Optical Communications

Conference

Conference	2008 International Nano-Optoelectronics Workshop, iNOW 2008 in Cooperation With International Global-COE Summer School (Photonics Integration-Core Electronics: PICE) and 31st International Symposium on Optical Communications
Country/Territory	Japan
City	Tokyo, Lake Saiko, Shanon Village
Period	08/8/2 → 08/8/15

ASJC Scopus subject areas

Computer Networks and Communications
Electrical and Electronic Engineering

Access to Document

10.1109/INOW.2008.4634540

Cite this

Matsui, J., Takahashi, H., Xie, N., Mizuno, J., & Utaka, K. (2008). Fabrication of silicon mold for thermal nanoimprint lithography. In 2008 Int. Nano-Optoelectronics Workshop, iNOW 2008 in Cooperation With Int. Global-COE Summer School (Photonics Integration-Core Electronics: PICE) and 31st Int. Symposium on Optical Communications (pp. 267-268). [4634540] (2008 Int. Nano-Optoelectronics Workshop, iNOW 2008 in Cooperation With Int. Global-COE Summer School (Photonics Integration-Core Electronics: PICE) and 31st Int. Symposium on Optical Communications). https://doi.org/10.1109/INOW.2008.4634540

Fabrication of silicon mold for thermal nanoimprint lithography. / Matsui, J.; Takahashi, H.; Xie, N. et al.

2008 Int. Nano-Optoelectronics Workshop, iNOW 2008 in Cooperation With Int. Global-COE Summer School (Photonics Integration-Core Electronics: PICE) and 31st Int. Symposium on Optical Communications. 2008. p. 267-268 4634540 (2008 Int. Nano-Optoelectronics Workshop, iNOW 2008 in Cooperation With Int. Global-COE Summer School (Photonics Integration-Core Electronics: PICE) and 31st Int. Symposium on Optical Communications).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Matsui, J, Takahashi, H, Xie, N, Mizuno, J & Utaka, K 2008, Fabrication of silicon mold for thermal nanoimprint lithography. in 2008 Int. Nano-Optoelectronics Workshop, iNOW 2008 in Cooperation With Int. Global-COE Summer School (Photonics Integration-Core Electronics: PICE) and 31st Int. Symposium on Optical Communications., 4634540, 2008 Int. Nano-Optoelectronics Workshop, iNOW 2008 in Cooperation With Int. Global-COE Summer School (Photonics Integration-Core Electronics: PICE) and 31st Int. Symposium on Optical Communications, pp. 267-268, 2008 International Nano-Optoelectronics Workshop, iNOW 2008 in Cooperation With International Global-COE Summer School (Photonics Integration-Core Electronics: PICE) and 31st International Symposium on Optical Communications, Tokyo, Lake Saiko, Shanon Village, Japan, 08/8/2. https://doi.org/10.1109/INOW.2008.4634540

Matsui J, Takahashi H, Xie N, Mizuno J, Utaka K. Fabrication of silicon mold for thermal nanoimprint lithography. In 2008 Int. Nano-Optoelectronics Workshop, iNOW 2008 in Cooperation With Int. Global-COE Summer School (Photonics Integration-Core Electronics: PICE) and 31st Int. Symposium on Optical Communications. 2008. p. 267-268. 4634540. (2008 Int. Nano-Optoelectronics Workshop, iNOW 2008 in Cooperation With Int. Global-COE Summer School (Photonics Integration-Core Electronics: PICE) and 31st Int. Symposium on Optical Communications). doi: 10.1109/INOW.2008.4634540

Matsui, J. ; Takahashi, H. ; Xie, N. et al. / Fabrication of silicon mold for thermal nanoimprint lithography. 2008 Int. Nano-Optoelectronics Workshop, iNOW 2008 in Cooperation With Int. Global-COE Summer School (Photonics Integration-Core Electronics: PICE) and 31st Int. Symposium on Optical Communications. 2008. pp. 267-268 (2008 Int. Nano-Optoelectronics Workshop, iNOW 2008 in Cooperation With Int. Global-COE Summer School (Photonics Integration-Core Electronics: PICE) and 31st Int. Symposium on Optical Communications).

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title = "Fabrication of silicon mold for thermal nanoimprint lithography",

abstract = "We fabricated a silicon mold for thermal Nanoimprint Lithography (NIL) with EB exposure and Deep-RIE. As a result, we obtained that including a grating whose pitch was 230nm with low roughness.",

author = "J. Matsui and H. Takahashi and N. Xie and J. Mizuno and K. Utaka",

year = "2008",

doi = "10.1109/INOW.2008.4634540",

language = "English",

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booktitle = "2008 Int. Nano-Optoelectronics Workshop, iNOW 2008 in Cooperation With Int. Global-COE Summer School (Photonics Integration-Core Electronics",

note = "2008 International Nano-Optoelectronics Workshop, iNOW 2008 in Cooperation With International Global-COE Summer School (Photonics Integration-Core Electronics: PICE) and 31st International Symposium on Optical Communications ; Conference date: 02-08-2008 Through 15-08-2008",

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AU - Utaka, K.

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Fabrication of silicon mold for thermal nanoimprint lithography

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