Fabrication of silicon mold for thermal nanoimprint lithography

J. Matsui, H. Takahashi, N. Xie, Jun Mizuno, Katsuyuki Utaka

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

We fabricated a silicon mold for thermal Nanoimprint Lithography (NIL) with EB exposure and Deep-RIE. As a result, we obtained that including a grating whose pitch was 230nm with low roughness.

Original languageEnglish
Title of host publication2008 Int. Nano-Optoelectronics Workshop, iNOW 2008 in Cooperation With Int. Global-COE Summer School (Photonics Integration-Core Electronics: PICE) and 31st Int. Symposium on Optical Communications
Pages267-268
Number of pages2
DOIs
Publication statusPublished - 2008
Event2008 International Nano-Optoelectronics Workshop, iNOW 2008 in Cooperation With International Global-COE Summer School (Photonics Integration-Core Electronics: PICE) and 31st International Symposium on Optical Communications - Tokyo, Lake Saiko, Shanon Village
Duration: 2008 Aug 2 → 2008 Aug 15

Other

Other2008 International Nano-Optoelectronics Workshop, iNOW 2008 in Cooperation With International Global-COE Summer School (Photonics Integration-Core Electronics: PICE) and 31st International Symposium on Optical Communications
CityTokyo, Lake Saiko, Shanon Village
Period08/8/2 → 08/8/15

Fingerprint

Nanoimprint lithography
Reactive ion etching
Surface roughness
Fabrication
Silicon
Hot Temperature

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Electrical and Electronic Engineering

Cite this

Matsui, J., Takahashi, H., Xie, N., Mizuno, J., & Utaka, K. (2008). Fabrication of silicon mold for thermal nanoimprint lithography. In 2008 Int. Nano-Optoelectronics Workshop, iNOW 2008 in Cooperation With Int. Global-COE Summer School (Photonics Integration-Core Electronics: PICE) and 31st Int. Symposium on Optical Communications (pp. 267-268). [4634540] https://doi.org/10.1109/INOW.2008.4634540

Fabrication of silicon mold for thermal nanoimprint lithography. / Matsui, J.; Takahashi, H.; Xie, N.; Mizuno, Jun; Utaka, Katsuyuki.

2008 Int. Nano-Optoelectronics Workshop, iNOW 2008 in Cooperation With Int. Global-COE Summer School (Photonics Integration-Core Electronics: PICE) and 31st Int. Symposium on Optical Communications. 2008. p. 267-268 4634540.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Matsui, J, Takahashi, H, Xie, N, Mizuno, J & Utaka, K 2008, Fabrication of silicon mold for thermal nanoimprint lithography. in 2008 Int. Nano-Optoelectronics Workshop, iNOW 2008 in Cooperation With Int. Global-COE Summer School (Photonics Integration-Core Electronics: PICE) and 31st Int. Symposium on Optical Communications., 4634540, pp. 267-268, 2008 International Nano-Optoelectronics Workshop, iNOW 2008 in Cooperation With International Global-COE Summer School (Photonics Integration-Core Electronics: PICE) and 31st International Symposium on Optical Communications, Tokyo, Lake Saiko, Shanon Village, 08/8/2. https://doi.org/10.1109/INOW.2008.4634540
Matsui J, Takahashi H, Xie N, Mizuno J, Utaka K. Fabrication of silicon mold for thermal nanoimprint lithography. In 2008 Int. Nano-Optoelectronics Workshop, iNOW 2008 in Cooperation With Int. Global-COE Summer School (Photonics Integration-Core Electronics: PICE) and 31st Int. Symposium on Optical Communications. 2008. p. 267-268. 4634540 https://doi.org/10.1109/INOW.2008.4634540
Matsui, J. ; Takahashi, H. ; Xie, N. ; Mizuno, Jun ; Utaka, Katsuyuki. / Fabrication of silicon mold for thermal nanoimprint lithography. 2008 Int. Nano-Optoelectronics Workshop, iNOW 2008 in Cooperation With Int. Global-COE Summer School (Photonics Integration-Core Electronics: PICE) and 31st Int. Symposium on Optical Communications. 2008. pp. 267-268
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