TY - GEN
T1 - Fabrication of silicon mold for thermal nanoimprint lithography
AU - Matsui, J.
AU - Takahashi, H.
AU - Xie, N.
AU - Mizuno, J.
AU - Utaka, K.
PY - 2008
Y1 - 2008
N2 - We fabricated a silicon mold for thermal Nanoimprint Lithography (NIL) with EB exposure and Deep-RIE. As a result, we obtained that including a grating whose pitch was 230nm with low roughness.
AB - We fabricated a silicon mold for thermal Nanoimprint Lithography (NIL) with EB exposure and Deep-RIE. As a result, we obtained that including a grating whose pitch was 230nm with low roughness.
UR - http://www.scopus.com/inward/record.url?scp=56449126978&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=56449126978&partnerID=8YFLogxK
U2 - 10.1109/INOW.2008.4634540
DO - 10.1109/INOW.2008.4634540
M3 - Conference contribution
AN - SCOPUS:56449126978
SN - 9781424426560
T3 - 2008 Int. Nano-Optoelectronics Workshop, iNOW 2008 in Cooperation With Int. Global-COE Summer School (Photonics Integration-Core Electronics: PICE) and 31st Int. Symposium on Optical Communications
SP - 267
EP - 268
BT - 2008 Int. Nano-Optoelectronics Workshop, iNOW 2008 in Cooperation With Int. Global-COE Summer School (Photonics Integration-Core Electronics
T2 - 2008 International Nano-Optoelectronics Workshop, iNOW 2008 in Cooperation With International Global-COE Summer School (Photonics Integration-Core Electronics: PICE) and 31st International Symposium on Optical Communications
Y2 - 2 August 2008 through 15 August 2008
ER -