This paper presents fabrication of the 3-D SU-8 fine micromesh structure and electroplated Ni micromesh structure. The SU-8 mesh structures were formed using multiple inclined UV exposure from backside of the SU-8 coated glass substrate with metal patterns. A few μm size pillars and pores were realized by optimizing the UV lithography conditions. The 3-D micromesh Ni structures were also fabricated using electroplating. The inverse-mesh photoresist structures, fabricated by multiple inclined backside exposure, were used as molds for Ni electroplating. Ni meshes of about 3μm in diameter were obtained by this method.