Fabrication of two-axis quartz MEMS-based capacitive tilt sensor

Jinxing Liang, Takahiro Matsuo, Fusao Kohsaka, Xuefeng Li, Ken Kunitomo, Toshitsugu Ueda

    Research output: Contribution to journalArticle

    7 Citations (Scopus)

    Abstract

    The design, fabrication packaging and evaluation of a two-axis quartz MEMS-based capacitive tilt sensor is described. Two same sensing elements are microfabricated using bulk anisotropic wet etching technique on one quartz chip. Sensing element 1 detects the tilt angle around Y axis giving the output 9 and sensing element 2 detects the information of Y axis and X axis, giving output γ. Microfabrication efforts are made on wet etching high aspect ratio gap between comb electrodes, good metal step coverage on the side wall of comb electrodes, and patterning surface leading wire and pads. The sensor is mounted on a designed ceramic package by flip chip method. A special spring structure is inserted between the two sensing elements for absorbing the residual stress caused by reflow process. The sensitivity of the fabricated sensor is evaluated using diode bridge capacitance detection circuit. In the range of ±1°, voltage outputs are 529 mV/° for sensing element 1 and 394 mV/° for sensing element 2 respectively. The detection accuracy of 0.001° was also examined.

    Original languageEnglish
    Pages (from-to)85-90
    Number of pages6
    JournalIEEJ Transactions on Sensors and Micromachines
    Volume128
    Issue number3
    DOIs
    Publication statusPublished - 2008

    Fingerprint

    Capacitive sensors
    Wet etching
    MEMS
    Quartz
    Fabrication
    Anisotropic etching
    Electrodes
    Microfabrication
    Sensors
    Aspect ratio
    Residual stresses
    Packaging
    Diodes
    Capacitance
    Wire
    Networks (circuits)
    Electric potential
    Metals

    Keywords

    • Capacitive tilt sensor
    • High aspect ratio
    • Lift off
    • MEMS
    • Quartz
    • Step coverage
    • Two-axis

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Mechanical Engineering

    Cite this

    Fabrication of two-axis quartz MEMS-based capacitive tilt sensor. / Liang, Jinxing; Matsuo, Takahiro; Kohsaka, Fusao; Li, Xuefeng; Kunitomo, Ken; Ueda, Toshitsugu.

    In: IEEJ Transactions on Sensors and Micromachines, Vol. 128, No. 3, 2008, p. 85-90.

    Research output: Contribution to journalArticle

    Liang, J, Matsuo, T, Kohsaka, F, Li, X, Kunitomo, K & Ueda, T 2008, 'Fabrication of two-axis quartz MEMS-based capacitive tilt sensor', IEEJ Transactions on Sensors and Micromachines, vol. 128, no. 3, pp. 85-90. https://doi.org/10.1541/ieejsmas.128.85
    Liang, Jinxing ; Matsuo, Takahiro ; Kohsaka, Fusao ; Li, Xuefeng ; Kunitomo, Ken ; Ueda, Toshitsugu. / Fabrication of two-axis quartz MEMS-based capacitive tilt sensor. In: IEEJ Transactions on Sensors and Micromachines. 2008 ; Vol. 128, No. 3. pp. 85-90.
    @article{5fba5c64403c44819bd0ca7f36bd64e1,
    title = "Fabrication of two-axis quartz MEMS-based capacitive tilt sensor",
    abstract = "The design, fabrication packaging and evaluation of a two-axis quartz MEMS-based capacitive tilt sensor is described. Two same sensing elements are microfabricated using bulk anisotropic wet etching technique on one quartz chip. Sensing element 1 detects the tilt angle around Y axis giving the output 9 and sensing element 2 detects the information of Y axis and X axis, giving output γ. Microfabrication efforts are made on wet etching high aspect ratio gap between comb electrodes, good metal step coverage on the side wall of comb electrodes, and patterning surface leading wire and pads. The sensor is mounted on a designed ceramic package by flip chip method. A special spring structure is inserted between the two sensing elements for absorbing the residual stress caused by reflow process. The sensitivity of the fabricated sensor is evaluated using diode bridge capacitance detection circuit. In the range of ±1°, voltage outputs are 529 mV/° for sensing element 1 and 394 mV/° for sensing element 2 respectively. The detection accuracy of 0.001° was also examined.",
    keywords = "Capacitive tilt sensor, High aspect ratio, Lift off, MEMS, Quartz, Step coverage, Two-axis",
    author = "Jinxing Liang and Takahiro Matsuo and Fusao Kohsaka and Xuefeng Li and Ken Kunitomo and Toshitsugu Ueda",
    year = "2008",
    doi = "10.1541/ieejsmas.128.85",
    language = "English",
    volume = "128",
    pages = "85--90",
    journal = "IEEJ Transactions on Sensors and Micromachines",
    issn = "1341-8939",
    publisher = "The Institute of Electrical Engineers of Japan",
    number = "3",

    }

    TY - JOUR

    T1 - Fabrication of two-axis quartz MEMS-based capacitive tilt sensor

    AU - Liang, Jinxing

    AU - Matsuo, Takahiro

    AU - Kohsaka, Fusao

    AU - Li, Xuefeng

    AU - Kunitomo, Ken

    AU - Ueda, Toshitsugu

    PY - 2008

    Y1 - 2008

    N2 - The design, fabrication packaging and evaluation of a two-axis quartz MEMS-based capacitive tilt sensor is described. Two same sensing elements are microfabricated using bulk anisotropic wet etching technique on one quartz chip. Sensing element 1 detects the tilt angle around Y axis giving the output 9 and sensing element 2 detects the information of Y axis and X axis, giving output γ. Microfabrication efforts are made on wet etching high aspect ratio gap between comb electrodes, good metal step coverage on the side wall of comb electrodes, and patterning surface leading wire and pads. The sensor is mounted on a designed ceramic package by flip chip method. A special spring structure is inserted between the two sensing elements for absorbing the residual stress caused by reflow process. The sensitivity of the fabricated sensor is evaluated using diode bridge capacitance detection circuit. In the range of ±1°, voltage outputs are 529 mV/° for sensing element 1 and 394 mV/° for sensing element 2 respectively. The detection accuracy of 0.001° was also examined.

    AB - The design, fabrication packaging and evaluation of a two-axis quartz MEMS-based capacitive tilt sensor is described. Two same sensing elements are microfabricated using bulk anisotropic wet etching technique on one quartz chip. Sensing element 1 detects the tilt angle around Y axis giving the output 9 and sensing element 2 detects the information of Y axis and X axis, giving output γ. Microfabrication efforts are made on wet etching high aspect ratio gap between comb electrodes, good metal step coverage on the side wall of comb electrodes, and patterning surface leading wire and pads. The sensor is mounted on a designed ceramic package by flip chip method. A special spring structure is inserted between the two sensing elements for absorbing the residual stress caused by reflow process. The sensitivity of the fabricated sensor is evaluated using diode bridge capacitance detection circuit. In the range of ±1°, voltage outputs are 529 mV/° for sensing element 1 and 394 mV/° for sensing element 2 respectively. The detection accuracy of 0.001° was also examined.

    KW - Capacitive tilt sensor

    KW - High aspect ratio

    KW - Lift off

    KW - MEMS

    KW - Quartz

    KW - Step coverage

    KW - Two-axis

    UR - http://www.scopus.com/inward/record.url?scp=70249123312&partnerID=8YFLogxK

    UR - http://www.scopus.com/inward/citedby.url?scp=70249123312&partnerID=8YFLogxK

    U2 - 10.1541/ieejsmas.128.85

    DO - 10.1541/ieejsmas.128.85

    M3 - Article

    AN - SCOPUS:70249123312

    VL - 128

    SP - 85

    EP - 90

    JO - IEEJ Transactions on Sensors and Micromachines

    JF - IEEJ Transactions on Sensors and Micromachines

    SN - 1341-8939

    IS - 3

    ER -