Fabrication of two-axis quartz MEMS-based capacitive tilt sensor

Jinxing Liang*, Takahiro Matsuo, Fusao Kohsaka, Xuefeng Li, Ken Kunitomo, Toshitsugu Ueda

*Corresponding author for this work

    Research output: Contribution to journalArticlepeer-review

    7 Citations (Scopus)


    The design, fabrication packaging and evaluation of a two-axis quartz MEMS-based capacitive tilt sensor is described. Two same sensing elements are microfabricated using bulk anisotropic wet etching technique on one quartz chip. Sensing element 1 detects the tilt angle around Y axis giving the output 9 and sensing element 2 detects the information of Y axis and X axis, giving output γ. Microfabrication efforts are made on wet etching high aspect ratio gap between comb electrodes, good metal step coverage on the side wall of comb electrodes, and patterning surface leading wire and pads. The sensor is mounted on a designed ceramic package by flip chip method. A special spring structure is inserted between the two sensing elements for absorbing the residual stress caused by reflow process. The sensitivity of the fabricated sensor is evaluated using diode bridge capacitance detection circuit. In the range of ±1°, voltage outputs are 529 mV/° for sensing element 1 and 394 mV/° for sensing element 2 respectively. The detection accuracy of 0.001° was also examined.

    Original languageEnglish
    Pages (from-to)85-90
    Number of pages6
    JournalIEEJ Transactions on Sensors and Micromachines
    Issue number3
    Publication statusPublished - 2008


    • Capacitive tilt sensor
    • High aspect ratio
    • Lift off
    • MEMS
    • Quartz
    • Step coverage
    • Two-axis

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Mechanical Engineering


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