Fabrications of micro-channel device by hot emboss and direct bonding of PMMA

Jun Mizuno, T. Harada, T. Glinsner, M. Ishizuka, T. Edura, K. Tsutsui, H. Ishida, Shuichi Shoji, Y. Wada

Research output: Chapter in Book/Report/Conference proceedingConference contribution

15 Citations (Scopus)

Abstract

We have fabricated and evaluated the mechanical, optical and fluidic characteristics a 50um wide and a 30um deep micro-channel device produced by hot emboss and direct bonding of PMMA plate with dimensions of 20mm x 20mm x 1mm. The fabricated micro-channel device was evaluated the bond strength, which was confirmed to be high enough for practical use as well as for quite severe cleaning conditions as ultrasonic cleaning in pure water. The optical loss around bonded interface was also evaluated and no increase in the light absorption was observed. The above results confirmed that the hot emboss and direct bonding technologies for micro-channel manufacturing using the PMMA plates realizes high performance micro channel devices.

Original languageEnglish
Title of host publicationProceedings - 2004 International Conference on MEMS, NANO and Smart Systems, ICMENS 2004
EditorsW. Badawy, W. Moussa
Pages26-29
Number of pages4
Publication statusPublished - 2004
EventProceedings - 2004 International Conference on MEMS, NANO and Smart Systems, ICMENS 2004 - Banff, Alta.
Duration: 2004 Aug 252004 Aug 27

Other

OtherProceedings - 2004 International Conference on MEMS, NANO and Smart Systems, ICMENS 2004
CityBanff, Alta.
Period04/8/2504/8/27

Fingerprint

Ultrasonic cleaning
Fabrication
Optical losses
Fluidics
Light absorption
Cleaning
Water

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Mizuno, J., Harada, T., Glinsner, T., Ishizuka, M., Edura, T., Tsutsui, K., ... Wada, Y. (2004). Fabrications of micro-channel device by hot emboss and direct bonding of PMMA. In W. Badawy, & W. Moussa (Eds.), Proceedings - 2004 International Conference on MEMS, NANO and Smart Systems, ICMENS 2004 (pp. 26-29)

Fabrications of micro-channel device by hot emboss and direct bonding of PMMA. / Mizuno, Jun; Harada, T.; Glinsner, T.; Ishizuka, M.; Edura, T.; Tsutsui, K.; Ishida, H.; Shoji, Shuichi; Wada, Y.

Proceedings - 2004 International Conference on MEMS, NANO and Smart Systems, ICMENS 2004. ed. / W. Badawy; W. Moussa. 2004. p. 26-29.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Mizuno, J, Harada, T, Glinsner, T, Ishizuka, M, Edura, T, Tsutsui, K, Ishida, H, Shoji, S & Wada, Y 2004, Fabrications of micro-channel device by hot emboss and direct bonding of PMMA. in W Badawy & W Moussa (eds), Proceedings - 2004 International Conference on MEMS, NANO and Smart Systems, ICMENS 2004. pp. 26-29, Proceedings - 2004 International Conference on MEMS, NANO and Smart Systems, ICMENS 2004, Banff, Alta., 04/8/25.
Mizuno J, Harada T, Glinsner T, Ishizuka M, Edura T, Tsutsui K et al. Fabrications of micro-channel device by hot emboss and direct bonding of PMMA. In Badawy W, Moussa W, editors, Proceedings - 2004 International Conference on MEMS, NANO and Smart Systems, ICMENS 2004. 2004. p. 26-29
Mizuno, Jun ; Harada, T. ; Glinsner, T. ; Ishizuka, M. ; Edura, T. ; Tsutsui, K. ; Ishida, H. ; Shoji, Shuichi ; Wada, Y. / Fabrications of micro-channel device by hot emboss and direct bonding of PMMA. Proceedings - 2004 International Conference on MEMS, NANO and Smart Systems, ICMENS 2004. editor / W. Badawy ; W. Moussa. 2004. pp. 26-29
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