Fabrications of micro-channel device by hot emboss and direct bonding of PMMA

J. Mizuno; T. Harada; T. Glinsner; M. Ishizuka; T. Edura; K. Tsutsui; H. Ishida; S. Shoji; Y. Wada

Fabrications of micro-channel device by hot emboss and direct bonding of PMMA

J. Mizuno^*, T. Harada, T. Glinsner, M. Ishizuka, T. Edura, K. Tsutsui, H. Ishida, S. Shoji, Y. Wada

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

18 Citations (Scopus)

Abstract

We have fabricated and evaluated the mechanical, optical and fluidic characteristics a 50um wide and a 30um deep micro-channel device produced by hot emboss and direct bonding of PMMA plate with dimensions of 20mm x 20mm x 1mm. The fabricated micro-channel device was evaluated the bond strength, which was confirmed to be high enough for practical use as well as for quite severe cleaning conditions as ultrasonic cleaning in pure water. The optical loss around bonded interface was also evaluated and no increase in the light absorption was observed. The above results confirmed that the hot emboss and direct bonding technologies for micro-channel manufacturing using the PMMA plates realizes high performance micro channel devices.

Original language	English
Title of host publication	Proceedings - 2004 International Conference on MEMS, NANO and Smart Systems, ICMENS 2004
Editors	W. Badawy, W. Moussa
Pages	26-29
Number of pages	4
Publication status	Published - 2004 Dec 1
Event	Proceedings - 2004 International Conference on MEMS, NANO and Smart Systems, ICMENS 2004 - Banff, Alta., Canada Duration: 2004 Aug 25 → 2004 Aug 27

Publication series

Name	Proceedings - 2004 International Conference on MEMS, NANO and Smart Systems, ICMENS 2004

Conference

Conference	Proceedings - 2004 International Conference on MEMS, NANO and Smart Systems, ICMENS 2004
Country/Territory	Canada
City	Banff, Alta.
Period	04/8/25 → 04/8/27

ASJC Scopus subject areas

Engineering(all)

Cite this

Mizuno, J., Harada, T., Glinsner, T., Ishizuka, M., Edura, T., Tsutsui, K., Ishida, H., Shoji, S., & Wada, Y. (2004). Fabrications of micro-channel device by hot emboss and direct bonding of PMMA. In W. Badawy, & W. Moussa (Eds.), Proceedings - 2004 International Conference on MEMS, NANO and Smart Systems, ICMENS 2004 (pp. 26-29). (Proceedings - 2004 International Conference on MEMS, NANO and Smart Systems, ICMENS 2004).

Fabrications of micro-channel device by hot emboss and direct bonding of PMMA. / Mizuno, J.; Harada, T.; Glinsner, T. et al.

Proceedings - 2004 International Conference on MEMS, NANO and Smart Systems, ICMENS 2004. ed. / W. Badawy; W. Moussa. 2004. p. 26-29 (Proceedings - 2004 International Conference on MEMS, NANO and Smart Systems, ICMENS 2004).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Mizuno, J, Harada, T, Glinsner, T, Ishizuka, M, Edura, T, Tsutsui, K, Ishida, H, Shoji, S & Wada, Y 2004, Fabrications of micro-channel device by hot emboss and direct bonding of PMMA. in W Badawy & W Moussa (eds), Proceedings - 2004 International Conference on MEMS, NANO and Smart Systems, ICMENS 2004. Proceedings - 2004 International Conference on MEMS, NANO and Smart Systems, ICMENS 2004, pp. 26-29, Proceedings - 2004 International Conference on MEMS, NANO and Smart Systems, ICMENS 2004, Banff, Alta., Canada, 04/8/25.

Mizuno J, Harada T, Glinsner T, Ishizuka M, Edura T, Tsutsui K et al. Fabrications of micro-channel device by hot emboss and direct bonding of PMMA. In Badawy W, Moussa W, editors, Proceedings - 2004 International Conference on MEMS, NANO and Smart Systems, ICMENS 2004. 2004. p. 26-29. (Proceedings - 2004 International Conference on MEMS, NANO and Smart Systems, ICMENS 2004).

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abstract = "We have fabricated and evaluated the mechanical, optical and fluidic characteristics a 50um wide and a 30um deep micro-channel device produced by hot emboss and direct bonding of PMMA plate with dimensions of 20mm x 20mm x 1mm. The fabricated micro-channel device was evaluated the bond strength, which was confirmed to be high enough for practical use as well as for quite severe cleaning conditions as ultrasonic cleaning in pure water. The optical loss around bonded interface was also evaluated and no increase in the light absorption was observed. The above results confirmed that the hot emboss and direct bonding technologies for micro-channel manufacturing using the PMMA plates realizes high performance micro channel devices.",

author = "J. Mizuno and T. Harada and T. Glinsner and M. Ishizuka and T. Edura and K. Tsutsui and H. Ishida and S. Shoji and Y. Wada",

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AU - Mizuno, J.

AU - Harada, T.

AU - Glinsner, T.

AU - Ishizuka, M.

AU - Edura, T.

AU - Tsutsui, K.

AU - Ishida, H.

AU - Shoji, S.

AU - Wada, Y.

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N2 - We have fabricated and evaluated the mechanical, optical and fluidic characteristics a 50um wide and a 30um deep micro-channel device produced by hot emboss and direct bonding of PMMA plate with dimensions of 20mm x 20mm x 1mm. The fabricated micro-channel device was evaluated the bond strength, which was confirmed to be high enough for practical use as well as for quite severe cleaning conditions as ultrasonic cleaning in pure water. The optical loss around bonded interface was also evaluated and no increase in the light absorption was observed. The above results confirmed that the hot emboss and direct bonding technologies for micro-channel manufacturing using the PMMA plates realizes high performance micro channel devices.

AB - We have fabricated and evaluated the mechanical, optical and fluidic characteristics a 50um wide and a 30um deep micro-channel device produced by hot emboss and direct bonding of PMMA plate with dimensions of 20mm x 20mm x 1mm. The fabricated micro-channel device was evaluated the bond strength, which was confirmed to be high enough for practical use as well as for quite severe cleaning conditions as ultrasonic cleaning in pure water. The optical loss around bonded interface was also evaluated and no increase in the light absorption was observed. The above results confirmed that the hot emboss and direct bonding technologies for micro-channel manufacturing using the PMMA plates realizes high performance micro channel devices.

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BT - Proceedings - 2004 International Conference on MEMS, NANO and Smart Systems, ICMENS 2004

A2 - Badawy, W.

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ER -

Fabrications of micro-channel device by hot emboss and direct bonding of PMMA

Abstract

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