Fiber-optic temperature sensor based on difference of thermal expansion coefficient between fused silica and metallic materials

Xuefeng Li, Shuo Lin, Jinxing Liang, Yupeng Zhang, Hiroshi Oigawa, Toshitsugu Ueda

Research output: Contribution to journalArticle

23 Citations (Scopus)

Abstract

In this paper, we report a novel fiber-optic Fabry-Perot interferometric (FFPI) temperature sensor based on the difference of thermal expansion coefficient between fused silica and metallic materials. The sensor head is made by a single-mode fiber (SMF). A gold film and a nickel film are sputtered and electroplated on the surface of the SMF. Then, a microcavity is micromachined by focused ion beam (FIB) milling. Because the thermal expansion coefficient of nickel is about 20 times of fused silica, the different thermal expansions force the sensor head to bend when the temperature is high or low. Its temperature sensitivity is over 14 pm°C in a wide range from 79°C to +70°C. And the coefficient of determination R 2 is excellent (over 0.995). Moreover, the metallic cylinder can reinforce the cavity spot of the fiber sensor, so that this kind of sensor can work in harsh environments. For the first time to the best of our knowledge, we report this type of FFPI temperature sensor based on difference of thermal expansion coefficient between fused silica and metallic materials.

Original languageEnglish
Article number6112705
Pages (from-to)155-162
Number of pages8
JournalIEEE Photonics Journal
Volume4
Issue number1
DOIs
Publication statusPublished - 2012

Fingerprint

Fiber optic sensors
temperature sensors
Temperature sensors
Fused silica
Thermal expansion
thermal expansion
fiber optics
silicon dioxide
sensors
Sensors
coefficients
Single mode fibers
Fiber optics
fibers
Nickel
nickel
Microcavities
Focused ion beams
Gold
ion beams

Keywords

  • Fabry-Perot interferometric (FFPI)
  • fiber sensor
  • focused ion beam milling
  • thermal expansion coefficient

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Atomic and Molecular Physics, and Optics

Cite this

Fiber-optic temperature sensor based on difference of thermal expansion coefficient between fused silica and metallic materials. / Li, Xuefeng; Lin, Shuo; Liang, Jinxing; Zhang, Yupeng; Oigawa, Hiroshi; Ueda, Toshitsugu.

In: IEEE Photonics Journal, Vol. 4, No. 1, 6112705, 2012, p. 155-162.

Research output: Contribution to journalArticle

Li, Xuefeng ; Lin, Shuo ; Liang, Jinxing ; Zhang, Yupeng ; Oigawa, Hiroshi ; Ueda, Toshitsugu. / Fiber-optic temperature sensor based on difference of thermal expansion coefficient between fused silica and metallic materials. In: IEEE Photonics Journal. 2012 ; Vol. 4, No. 1. pp. 155-162.
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