Fine-pitch hybrid bonding with Cu/Sn microbumps and adhesive for high density 3D integration

Masaki Ohyama, Jun Mizuno, Shuichi Shoji, Masatsugu Nimura, Toshihisa Nonaka, Yoichi Shinba, Akitsu Shigetou

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

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Engineering & Materials Science

Chemical Compounds