Flexible tactile sensor for shear stress measurement using transferred sub-μm-thick Si piezoresistive cantilevers

Kentaro Noda, Hiroaki Onoe, Eiji Iwase, Kiyoshi Matsumoto, Isao Shimoyama

    Research output: Contribution to journalArticle

    16 Citations (Scopus)

    Abstract

    We propose a flexible tactile sensor using sub-m-thick Si piezoresistive cantilevers for shear stress detection. The thin Si piezoresistive cantilevers were fabricated on the device layer of a silicon on insulator (SOI) wafer. By using an adhesion-based transfer method, only these thin and fragile cantilevers were transferred from the rigid handling layer of the SOI wafer to the polydimethylsiloxane layer without damage. Because the thin Si cantilevers have high durability of bending, the proposed sensor can be attached to a thin rod-type structure serving as the finger of a robotic hand. The cantilevers were arrayed in orthogonal directions to measure the X and Y directional components of applied shear stresses independently. We evaluated the bending durability of our flexible tactile sensor and confirmed that the sensor can be attached to a rod with a radius of 10mm. The sensitivity of the flexible tactile sensor attached to a curved surface was 1.7×106Pa1on average for a range of shear stresses from1.8×103to 1.8×103Pa applied along its surface. It independently detected the X and Y directional components of the applied shear stresses.

    Original languageEnglish
    Article number115025
    JournalJournal of Micromechanics and Microengineering
    Volume22
    Issue number11
    DOIs
    Publication statusPublished - 2012 Nov

    Fingerprint

    Stress measurement
    Shear stress
    Sensors
    Silicon
    Durability
    Polydimethylsiloxane
    End effectors
    Adhesion

    ASJC Scopus subject areas

    • Mechanical Engineering
    • Electrical and Electronic Engineering
    • Mechanics of Materials
    • Electronic, Optical and Magnetic Materials

    Cite this

    Flexible tactile sensor for shear stress measurement using transferred sub-μm-thick Si piezoresistive cantilevers. / Noda, Kentaro; Onoe, Hiroaki; Iwase, Eiji; Matsumoto, Kiyoshi; Shimoyama, Isao.

    In: Journal of Micromechanics and Microengineering, Vol. 22, No. 11, 115025, 11.2012.

    Research output: Contribution to journalArticle

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