Flip chip bonding of a quartz MEMS-based vibrating beam accelerometer

Jinxing Liang, Liyuan Zhang, Ling Wang, Yuan Dong, Toshitsugu Ueda

    Research output: Contribution to journalArticle

    8 Citations (Scopus)

    Abstract

    In this study, a novel method to assemble a micro-accelerometer by a flip chip bonding technique is proposed and demonstrated. Both the main two parts of the accelerometer, a double-ended tuning fork and a base-proof mass structure, are fabricated using a quartz wet etching process on Z cut quartz wafers with a thickness of 100 μm and 300 μm, respectively. The finite element method is used to simulate the vibration mode and optimize the sensing element structure. Taking advantage of self-alignment function of the flip chip bonding process, the two parts were precisely bonded at the desired joint position via AuSn solder. Experimental demonstrations were performed on a maximum scale of 4 × 8 mm<sup>2</sup> chip, and high sensitivity up to 9.55 Hz/g with a DETF resonator and a Q value of 5000 in air was achieved.

    Original languageEnglish
    Pages (from-to)22049-22059
    Number of pages11
    JournalSensors (Switzerland)
    Volume15
    Issue number9
    DOIs
    Publication statusPublished - 2015 Sep 2

    Fingerprint

    Micro-Electrical-Mechanical Systems
    Quartz
    accelerometers
    Accelerometers
    microelectromechanical systems
    MEMS
    quartz
    chips
    Wet etching
    Vibration
    Soldering alloys
    self alignment
    Resonators
    forks
    Demonstrations
    Tuning
    Joints
    Air
    solders
    Finite element method

    Keywords

    • Double ended tuning fork
    • Flip chip bonding
    • Quartz MEMS
    • Self-alignment
    • Vibrating beam accelerometer

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Atomic and Molecular Physics, and Optics
    • Analytical Chemistry
    • Biochemistry

    Cite this

    Liang, J., Zhang, L., Wang, L., Dong, Y., & Ueda, T. (2015). Flip chip bonding of a quartz MEMS-based vibrating beam accelerometer. Sensors (Switzerland), 15(9), 22049-22059. https://doi.org/10.3390/s150922049

    Flip chip bonding of a quartz MEMS-based vibrating beam accelerometer. / Liang, Jinxing; Zhang, Liyuan; Wang, Ling; Dong, Yuan; Ueda, Toshitsugu.

    In: Sensors (Switzerland), Vol. 15, No. 9, 02.09.2015, p. 22049-22059.

    Research output: Contribution to journalArticle

    Liang, J, Zhang, L, Wang, L, Dong, Y & Ueda, T 2015, 'Flip chip bonding of a quartz MEMS-based vibrating beam accelerometer', Sensors (Switzerland), vol. 15, no. 9, pp. 22049-22059. https://doi.org/10.3390/s150922049
    Liang, Jinxing ; Zhang, Liyuan ; Wang, Ling ; Dong, Yuan ; Ueda, Toshitsugu. / Flip chip bonding of a quartz MEMS-based vibrating beam accelerometer. In: Sensors (Switzerland). 2015 ; Vol. 15, No. 9. pp. 22049-22059.
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