Flip-Chip Interconnection Technique for beyond 100-Gb/s (4 × 25.8-Gb/s) EADFB Laser Array Transmitter

Shigeru Kanazawa, Takeshi Fujisawa, Kiyoto Takahata, Yuta Ueda, Hiroyuki Ishii, Ryuzo Iga, Wataru Kobayashi, Hiroaki Sanjoh

Research output: Contribution to journalArticle

7 Citations (Scopus)

Abstract

We developed a flip-chip interconnection technique that is suitable for an EADFB laser array transmitter operating at more than 100 Gb/s (4 × 25 Gb/s). The flip-chip interconnection technique provides a good thermal flow comparable to that of the conventional wire interconnection technique but with a higher modulation bandwidth and lower electrical crosstalk. For a flip-chip interconnection 112-Gb/s (4 × 27.9 Gb/s) module, the OTU4 mask margin is only 4% worse for simultaneous four-channel operation than for single-channel operation. For a flip-chip interconnection 400-Gb/s (8 × 50 Gb/s) module, we obtained clear eye openings for all eight lanes with simultaneous eight-channel operation.

Original languageEnglish
Article number7173428
Pages (from-to)296-302
Number of pages7
JournalJournal of Lightwave Technology
Volume34
Issue number2
DOIs
Publication statusPublished - 2016 Jan 15
Externally publishedYes

Fingerprint

laser arrays
transmitters
chips
modules
crosstalk
margins
masks
wire
bandwidth
modulation

Keywords

  • 100 gigabit Ethernet
  • 400 gigabit Ethernet
  • Electro-absorption modulator
  • Flip-chip devices
  • Photonic integrated circuits
  • Semiconductor device packaging
  • Semiconductor laser arrays
  • Semiconductor lasers

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics

Cite this

Flip-Chip Interconnection Technique for beyond 100-Gb/s (4 × 25.8-Gb/s) EADFB Laser Array Transmitter. / Kanazawa, Shigeru; Fujisawa, Takeshi; Takahata, Kiyoto; Ueda, Yuta; Ishii, Hiroyuki; Iga, Ryuzo; Kobayashi, Wataru; Sanjoh, Hiroaki.

In: Journal of Lightwave Technology, Vol. 34, No. 2, 7173428, 15.01.2016, p. 296-302.

Research output: Contribution to journalArticle

Kanazawa, S, Fujisawa, T, Takahata, K, Ueda, Y, Ishii, H, Iga, R, Kobayashi, W & Sanjoh, H 2016, 'Flip-Chip Interconnection Technique for beyond 100-Gb/s (4 × 25.8-Gb/s) EADFB Laser Array Transmitter', Journal of Lightwave Technology, vol. 34, no. 2, 7173428, pp. 296-302. https://doi.org/10.1109/JLT.2015.2462728
Kanazawa, Shigeru ; Fujisawa, Takeshi ; Takahata, Kiyoto ; Ueda, Yuta ; Ishii, Hiroyuki ; Iga, Ryuzo ; Kobayashi, Wataru ; Sanjoh, Hiroaki. / Flip-Chip Interconnection Technique for beyond 100-Gb/s (4 × 25.8-Gb/s) EADFB Laser Array Transmitter. In: Journal of Lightwave Technology. 2016 ; Vol. 34, No. 2. pp. 296-302.
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