Fluxless bonding for fine-pitch and low-volume solder 3-D interconnections

K. Sakuma, K. Toriyama, H. Noma, K. Sueoka, N. Unami, Jun Mizuno, Shuichi Shoji, Y. Orii

Research output: Chapter in Book/Report/Conference proceedingConference contribution

18 Citations (Scopus)

Abstract

Fluxless bonding can be used for fine-pitch low-solder-volume interconnections for three-dimensional large-scale integrated-circuit (3D-LSI) applications. Surface treatments with hydrogen radicals, formic acid, vacuum ultraviolet (VUV), and Ar plasma were evaluated as candidate methods for fluxless bonding. Three-m-thick Sn solders were evaluated for intermetallic-compound (IMC) bonding of 3D integration as a target material for fluxless bonding. X-ray photoelectron spectroscopy (XPS), Auger electron spectro-scopy (AES), time-of-flight secondary ion mass spectrometry (TOF-SIMS), a scanning electron microscope (SEM), and a focused ion beam scanning ion microscope (FIB-SIM) were used to examine the samples. The experiments shows solder oxides and organic contaminants on the surfaces of the micro-bumps were most effectively eliminated without flux by hydrogen radical treatment among various treatments we evaluated. Bonding strength was also improved by the hydrogen radical treatment, since the shear strength was more than 50 times stronger than that of the untreated samples.

Original languageEnglish
Title of host publicationProceedings - Electronic Components and Technology Conference
Pages7-13
Number of pages7
DOIs
Publication statusPublished - 2011
Event2011 61st Electronic Components and Technology Conference, ECTC 2011 - Lake Buena Vista, FL
Duration: 2011 May 312011 Jun 3

Other

Other2011 61st Electronic Components and Technology Conference, ECTC 2011
CityLake Buena Vista, FL
Period11/5/3111/6/3

Fingerprint

Soldering alloys
Hydrogen
formic acid
Ion microscopes
Scanning
Focused ion beams
Formic acid
Secondary ion mass spectrometry
Shear strength
Oxides
Intermetallics
Surface treatment
Electron microscopes
X ray photoelectron spectroscopy
Vacuum
Impurities
Fluxes
Plasmas
Electrons
Experiments

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Sakuma, K., Toriyama, K., Noma, H., Sueoka, K., Unami, N., Mizuno, J., ... Orii, Y. (2011). Fluxless bonding for fine-pitch and low-volume solder 3-D interconnections. In Proceedings - Electronic Components and Technology Conference (pp. 7-13). [5898483] https://doi.org/10.1109/ECTC.2011.5898483

Fluxless bonding for fine-pitch and low-volume solder 3-D interconnections. / Sakuma, K.; Toriyama, K.; Noma, H.; Sueoka, K.; Unami, N.; Mizuno, Jun; Shoji, Shuichi; Orii, Y.

Proceedings - Electronic Components and Technology Conference. 2011. p. 7-13 5898483.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Sakuma, K, Toriyama, K, Noma, H, Sueoka, K, Unami, N, Mizuno, J, Shoji, S & Orii, Y 2011, Fluxless bonding for fine-pitch and low-volume solder 3-D interconnections. in Proceedings - Electronic Components and Technology Conference., 5898483, pp. 7-13, 2011 61st Electronic Components and Technology Conference, ECTC 2011, Lake Buena Vista, FL, 11/5/31. https://doi.org/10.1109/ECTC.2011.5898483
Sakuma K, Toriyama K, Noma H, Sueoka K, Unami N, Mizuno J et al. Fluxless bonding for fine-pitch and low-volume solder 3-D interconnections. In Proceedings - Electronic Components and Technology Conference. 2011. p. 7-13. 5898483 https://doi.org/10.1109/ECTC.2011.5898483
Sakuma, K. ; Toriyama, K. ; Noma, H. ; Sueoka, K. ; Unami, N. ; Mizuno, Jun ; Shoji, Shuichi ; Orii, Y. / Fluxless bonding for fine-pitch and low-volume solder 3-D interconnections. Proceedings - Electronic Components and Technology Conference. 2011. pp. 7-13
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