Fluxless bonding for fine-pitch and low-volume solder 3-D interconnections

K. Sakuma, K. Toriyama, H. Noma, K. Sueoka, N. Unami, J. Mizuno, S. Shoji, Y. Orii

Research output: Chapter in Book/Report/Conference proceedingConference contribution

19 Citations (Scopus)

Abstract

Fluxless bonding can be used for fine-pitch low-solder-volume interconnections for three-dimensional large-scale integrated-circuit (3D-LSI) applications. Surface treatments with hydrogen radicals, formic acid, vacuum ultraviolet (VUV), and Ar plasma were evaluated as candidate methods for fluxless bonding. Three-m-thick Sn solders were evaluated for intermetallic-compound (IMC) bonding of 3D integration as a target material for fluxless bonding. X-ray photoelectron spectroscopy (XPS), Auger electron spectro-scopy (AES), time-of-flight secondary ion mass spectrometry (TOF-SIMS), a scanning electron microscope (SEM), and a focused ion beam scanning ion microscope (FIB-SIM) were used to examine the samples. The experiments shows solder oxides and organic contaminants on the surfaces of the micro-bumps were most effectively eliminated without flux by hydrogen radical treatment among various treatments we evaluated. Bonding strength was also improved by the hydrogen radical treatment, since the shear strength was more than 50 times stronger than that of the untreated samples.

Original languageEnglish
Title of host publication2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011
Pages7-13
Number of pages7
DOIs
Publication statusPublished - 2011
Event2011 61st Electronic Components and Technology Conference, ECTC 2011 - Lake Buena Vista, FL, United States
Duration: 2011 May 312011 Jun 3

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Conference

Conference2011 61st Electronic Components and Technology Conference, ECTC 2011
CountryUnited States
CityLake Buena Vista, FL
Period11/5/3111/6/3

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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    Sakuma, K., Toriyama, K., Noma, H., Sueoka, K., Unami, N., Mizuno, J., Shoji, S., & Orii, Y. (2011). Fluxless bonding for fine-pitch and low-volume solder 3-D interconnections. In 2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011 (pp. 7-13). [5898483] (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2011.5898483