TY - GEN
T1 - Fluxless bonding for fine-pitch and low-volume solder 3-D interconnections
AU - Sakuma, K.
AU - Toriyama, K.
AU - Noma, H.
AU - Sueoka, K.
AU - Unami, N.
AU - Mizuno, J.
AU - Shoji, S.
AU - Orii, Y.
PY - 2011
Y1 - 2011
N2 - Fluxless bonding can be used for fine-pitch low-solder-volume interconnections for three-dimensional large-scale integrated-circuit (3D-LSI) applications. Surface treatments with hydrogen radicals, formic acid, vacuum ultraviolet (VUV), and Ar plasma were evaluated as candidate methods for fluxless bonding. Three-m-thick Sn solders were evaluated for intermetallic-compound (IMC) bonding of 3D integration as a target material for fluxless bonding. X-ray photoelectron spectroscopy (XPS), Auger electron spectro-scopy (AES), time-of-flight secondary ion mass spectrometry (TOF-SIMS), a scanning electron microscope (SEM), and a focused ion beam scanning ion microscope (FIB-SIM) were used to examine the samples. The experiments shows solder oxides and organic contaminants on the surfaces of the micro-bumps were most effectively eliminated without flux by hydrogen radical treatment among various treatments we evaluated. Bonding strength was also improved by the hydrogen radical treatment, since the shear strength was more than 50 times stronger than that of the untreated samples.
AB - Fluxless bonding can be used for fine-pitch low-solder-volume interconnections for three-dimensional large-scale integrated-circuit (3D-LSI) applications. Surface treatments with hydrogen radicals, formic acid, vacuum ultraviolet (VUV), and Ar plasma were evaluated as candidate methods for fluxless bonding. Three-m-thick Sn solders were evaluated for intermetallic-compound (IMC) bonding of 3D integration as a target material for fluxless bonding. X-ray photoelectron spectroscopy (XPS), Auger electron spectro-scopy (AES), time-of-flight secondary ion mass spectrometry (TOF-SIMS), a scanning electron microscope (SEM), and a focused ion beam scanning ion microscope (FIB-SIM) were used to examine the samples. The experiments shows solder oxides and organic contaminants on the surfaces of the micro-bumps were most effectively eliminated without flux by hydrogen radical treatment among various treatments we evaluated. Bonding strength was also improved by the hydrogen radical treatment, since the shear strength was more than 50 times stronger than that of the untreated samples.
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U2 - 10.1109/ECTC.2011.5898483
DO - 10.1109/ECTC.2011.5898483
M3 - Conference contribution
AN - SCOPUS:79960418228
SN - 9781612844978
T3 - Proceedings - Electronic Components and Technology Conference
SP - 7
EP - 13
BT - 2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011
T2 - 2011 61st Electronic Components and Technology Conference, ECTC 2011
Y2 - 31 May 2011 through 3 June 2011
ER -