Fluxless bonding for fine-pitch and low-volume solder 3-D interconnections

K. Sakuma*, K. Toriyama, H. Noma, K. Sueoka, N. Unami, J. Mizuno, S. Shoji, Y. Orii

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

22 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Fluxless bonding for fine-pitch and low-volume solder 3-D interconnections'. Together they form a unique fingerprint.

Chemical Compounds

Engineering & Materials Science