Formation of Microprobe Using Nickel Electrodeposition

Yuko Sugai, Fujio Asa, Yasuyuki Okada, Tokihiko Yokoshima, Toshiyuki Momma, Tetsuya Osaka, Tadatsugu Ito

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

Formation of Ni microstructure with high aspect ratio without thicker photoresist was tried by an electrcdeposition method. The Ni microprobes thicker than photoresist thickness were electrodeposited on a patterned substrate using thin photoresist patterned with UV radiation. It was important for preparing Ni microprobe with high aspect ratio to keep the overpotential of patterned cathode higher, and moreover the agitation using a paddle plating cell system was so effective to form uniform microprobes.

Original languageEnglish
Pages (from-to)1150-1152
Number of pages3
JournalElectrochemistry
Volume67
Issue number12
Publication statusPublished - 1999 Dec

Fingerprint

Photoresists
Nickel
Electrodeposition
Aspect ratio
Plating
Ultraviolet radiation
Cathodes
Microstructure
Substrates

Keywords

  • High Aspect Ratio
  • Micro-patterning
  • Ni Electrodeposition

ASJC Scopus subject areas

  • Electrochemistry

Cite this

Sugai, Y., Asa, F., Okada, Y., Yokoshima, T., Momma, T., Osaka, T., & Ito, T. (1999). Formation of Microprobe Using Nickel Electrodeposition. Electrochemistry, 67(12), 1150-1152.

Formation of Microprobe Using Nickel Electrodeposition. / Sugai, Yuko; Asa, Fujio; Okada, Yasuyuki; Yokoshima, Tokihiko; Momma, Toshiyuki; Osaka, Tetsuya; Ito, Tadatsugu.

In: Electrochemistry, Vol. 67, No. 12, 12.1999, p. 1150-1152.

Research output: Contribution to journalArticle

Sugai, Y, Asa, F, Okada, Y, Yokoshima, T, Momma, T, Osaka, T & Ito, T 1999, 'Formation of Microprobe Using Nickel Electrodeposition', Electrochemistry, vol. 67, no. 12, pp. 1150-1152.
Sugai, Yuko ; Asa, Fujio ; Okada, Yasuyuki ; Yokoshima, Tokihiko ; Momma, Toshiyuki ; Osaka, Tetsuya ; Ito, Tadatsugu. / Formation of Microprobe Using Nickel Electrodeposition. In: Electrochemistry. 1999 ; Vol. 67, No. 12. pp. 1150-1152.
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