Fracture of sustained tensile-loaded Sn-3.0Ag-0.5Cu solder alloy in NaCl solution

Ken'ichi Yokoyama; Daisuke Tsuji; Jun'ichi Sakai

doi:10.1016/j.corsci.2011.06.010

Fracture of sustained tensile-loaded Sn-3.0Ag-0.5Cu solder alloy in NaCl solution

Ken'ichi Yokoyama, Daisuke Tsuji, Jun'ichi Sakai

Research output: Contribution to journal › Article › peer-review

8 Citations (Scopus)

Abstract

The fracture of Sn-3.0Ag-0.5Cu solder alloy has been investigated by a constant sustained tensile-loading test in 0.9. wt.% NaCl aqueous solution at room temperature. Under applied stress in the solution, many cracks nucleate and propagate on the side surface of the specimen. The fracture is not an ordinary creep rupture mode and is probably caused by the decrease in cross section of the specimen due to crack propagation. The preferential dissolution of Ag and Cu ions is clearly observed under applied stress in the solution. The time to fracture and the critical stress for fracture in the solution are lower than those in the atmosphere. The present results indicate that the reliability of lead-free solder alloys must be evaluated considering the effects of the combination of environment and applied stress.

Original language	English
Pages (from-to)	3331-3336
Number of pages	6
Journal	Corrosion Science
Volume	53
Issue number	10
DOIs	https://doi.org/10.1016/j.corsci.2011.06.010
Publication status	Published - 2011 Oct

Keywords

A. Electronic materials
A. Tin
B. SEM
C. Intergranular corrosion
C. Stress corrosion

ASJC Scopus subject areas

Materials Science(all)
Chemical Engineering(all)
Chemistry(all)

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@article{dea66f025f384f05add619a6fc508a0d,

title = "Fracture of sustained tensile-loaded Sn-3.0Ag-0.5Cu solder alloy in NaCl solution",

abstract = "The fracture of Sn-3.0Ag-0.5Cu solder alloy has been investigated by a constant sustained tensile-loading test in 0.9. wt.% NaCl aqueous solution at room temperature. Under applied stress in the solution, many cracks nucleate and propagate on the side surface of the specimen. The fracture is not an ordinary creep rupture mode and is probably caused by the decrease in cross section of the specimen due to crack propagation. The preferential dissolution of Ag and Cu ions is clearly observed under applied stress in the solution. The time to fracture and the critical stress for fracture in the solution are lower than those in the atmosphere. The present results indicate that the reliability of lead-free solder alloys must be evaluated considering the effects of the combination of environment and applied stress.",

keywords = "A. Electronic materials, A. Tin, B. SEM, C. Intergranular corrosion, C. Stress corrosion",

author = "Ken'ichi Yokoyama and Daisuke Tsuji and Jun'ichi Sakai",

year = "2011",

month = oct,

doi = "10.1016/j.corsci.2011.06.010",

language = "English",

volume = "53",

pages = "3331--3336",

journal = "Corrosion Science",

issn = "0010-938X",

publisher = "Elsevier Limited",

number = "10",

}

TY - JOUR

T1 - Fracture of sustained tensile-loaded Sn-3.0Ag-0.5Cu solder alloy in NaCl solution

AU - Yokoyama, Ken'ichi

AU - Tsuji, Daisuke

AU - Sakai, Jun'ichi

PY - 2011/10

Y1 - 2011/10

N2 - The fracture of Sn-3.0Ag-0.5Cu solder alloy has been investigated by a constant sustained tensile-loading test in 0.9. wt.% NaCl aqueous solution at room temperature. Under applied stress in the solution, many cracks nucleate and propagate on the side surface of the specimen. The fracture is not an ordinary creep rupture mode and is probably caused by the decrease in cross section of the specimen due to crack propagation. The preferential dissolution of Ag and Cu ions is clearly observed under applied stress in the solution. The time to fracture and the critical stress for fracture in the solution are lower than those in the atmosphere. The present results indicate that the reliability of lead-free solder alloys must be evaluated considering the effects of the combination of environment and applied stress.

AB - The fracture of Sn-3.0Ag-0.5Cu solder alloy has been investigated by a constant sustained tensile-loading test in 0.9. wt.% NaCl aqueous solution at room temperature. Under applied stress in the solution, many cracks nucleate and propagate on the side surface of the specimen. The fracture is not an ordinary creep rupture mode and is probably caused by the decrease in cross section of the specimen due to crack propagation. The preferential dissolution of Ag and Cu ions is clearly observed under applied stress in the solution. The time to fracture and the critical stress for fracture in the solution are lower than those in the atmosphere. The present results indicate that the reliability of lead-free solder alloys must be evaluated considering the effects of the combination of environment and applied stress.

KW - A. Electronic materials

KW - A. Tin

KW - B. SEM

KW - C. Intergranular corrosion

KW - C. Stress corrosion

UR - http://www.scopus.com/inward/record.url?scp=79960713274&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=79960713274&partnerID=8YFLogxK

U2 - 10.1016/j.corsci.2011.06.010

DO - 10.1016/j.corsci.2011.06.010

M3 - Article

AN - SCOPUS:79960713274

VL - 53

SP - 3331

EP - 3336

JO - Corrosion Science

JF - Corrosion Science

SN - 0010-938X

IS - 10

ER -