Abstract
The fracture of Sn-3.0Ag-0.5Cu solder alloy has been investigated by a constant sustained tensile-loading test in 0.9. wt.% NaCl aqueous solution at room temperature. Under applied stress in the solution, many cracks nucleate and propagate on the side surface of the specimen. The fracture is not an ordinary creep rupture mode and is probably caused by the decrease in cross section of the specimen due to crack propagation. The preferential dissolution of Ag and Cu ions is clearly observed under applied stress in the solution. The time to fracture and the critical stress for fracture in the solution are lower than those in the atmosphere. The present results indicate that the reliability of lead-free solder alloys must be evaluated considering the effects of the combination of environment and applied stress.
| Original language | English |
|---|---|
| Pages (from-to) | 3331-3336 |
| Number of pages | 6 |
| Journal | Corrosion Science |
| Volume | 53 |
| Issue number | 10 |
| DOIs | |
| Publication status | Published - 2011 Oct |
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Keywords
- A. Electronic materials
- A. Tin
- B. SEM
- C. Intergranular corrosion
- C. Stress corrosion
ASJC Scopus subject areas
- Materials Science(all)
- Chemical Engineering(all)
- Chemistry(all)
Cite this
Fracture of sustained tensile-loaded Sn-3.0Ag-0.5Cu solder alloy in NaCl solution. / Yokoyama, Ken'ichi; Tsuji, Daisuke; Sakai, Jun'ichi.
In: Corrosion Science, Vol. 53, No. 10, 10.2011, p. 3331-3336.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Fracture of sustained tensile-loaded Sn-3.0Ag-0.5Cu solder alloy in NaCl solution
AU - Yokoyama, Ken'ichi
AU - Tsuji, Daisuke
AU - Sakai, Jun'ichi
PY - 2011/10
Y1 - 2011/10
N2 - The fracture of Sn-3.0Ag-0.5Cu solder alloy has been investigated by a constant sustained tensile-loading test in 0.9. wt.% NaCl aqueous solution at room temperature. Under applied stress in the solution, many cracks nucleate and propagate on the side surface of the specimen. The fracture is not an ordinary creep rupture mode and is probably caused by the decrease in cross section of the specimen due to crack propagation. The preferential dissolution of Ag and Cu ions is clearly observed under applied stress in the solution. The time to fracture and the critical stress for fracture in the solution are lower than those in the atmosphere. The present results indicate that the reliability of lead-free solder alloys must be evaluated considering the effects of the combination of environment and applied stress.
AB - The fracture of Sn-3.0Ag-0.5Cu solder alloy has been investigated by a constant sustained tensile-loading test in 0.9. wt.% NaCl aqueous solution at room temperature. Under applied stress in the solution, many cracks nucleate and propagate on the side surface of the specimen. The fracture is not an ordinary creep rupture mode and is probably caused by the decrease in cross section of the specimen due to crack propagation. The preferential dissolution of Ag and Cu ions is clearly observed under applied stress in the solution. The time to fracture and the critical stress for fracture in the solution are lower than those in the atmosphere. The present results indicate that the reliability of lead-free solder alloys must be evaluated considering the effects of the combination of environment and applied stress.
KW - A. Electronic materials
KW - A. Tin
KW - B. SEM
KW - C. Intergranular corrosion
KW - C. Stress corrosion
UR - http://www.scopus.com/inward/record.url?scp=79960713274&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=79960713274&partnerID=8YFLogxK
U2 - 10.1016/j.corsci.2011.06.010
DO - 10.1016/j.corsci.2011.06.010
M3 - Article
AN - SCOPUS:79960713274
VL - 53
SP - 3331
EP - 3336
JO - Corrosion Science
JF - Corrosion Science
SN - 0010-938X
IS - 10
ER -