Fracture of sustained tensile-loaded Sn-3.0Ag-0.5Cu solder alloy in NaCl solution

Ken'ichi Yokoyama, Daisuke Tsuji, Jun'ichi Sakai

    Research output: Contribution to journalArticle

    7 Citations (Scopus)

    Abstract

    The fracture of Sn-3.0Ag-0.5Cu solder alloy has been investigated by a constant sustained tensile-loading test in 0.9. wt.% NaCl aqueous solution at room temperature. Under applied stress in the solution, many cracks nucleate and propagate on the side surface of the specimen. The fracture is not an ordinary creep rupture mode and is probably caused by the decrease in cross section of the specimen due to crack propagation. The preferential dissolution of Ag and Cu ions is clearly observed under applied stress in the solution. The time to fracture and the critical stress for fracture in the solution are lower than those in the atmosphere. The present results indicate that the reliability of lead-free solder alloys must be evaluated considering the effects of the combination of environment and applied stress.

    Original languageEnglish
    Pages (from-to)3331-3336
    Number of pages6
    JournalCorrosion Science
    Volume53
    Issue number10
    DOIs
    Publication statusPublished - 2011 Oct

    Fingerprint

    Soldering alloys
    Crack propagation
    Creep
    Dissolution
    Ions
    Cracks
    Temperature

    Keywords

    • A. Electronic materials
    • A. Tin
    • B. SEM
    • C. Intergranular corrosion
    • C. Stress corrosion

    ASJC Scopus subject areas

    • Materials Science(all)
    • Chemical Engineering(all)
    • Chemistry(all)

    Cite this

    Fracture of sustained tensile-loaded Sn-3.0Ag-0.5Cu solder alloy in NaCl solution. / Yokoyama, Ken'ichi; Tsuji, Daisuke; Sakai, Jun'ichi.

    In: Corrosion Science, Vol. 53, No. 10, 10.2011, p. 3331-3336.

    Research output: Contribution to journalArticle

    Yokoyama, Ken'ichi ; Tsuji, Daisuke ; Sakai, Jun'ichi. / Fracture of sustained tensile-loaded Sn-3.0Ag-0.5Cu solder alloy in NaCl solution. In: Corrosion Science. 2011 ; Vol. 53, No. 10. pp. 3331-3336.
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