Frequency accelerated partial discharge resistance of epoxy/clay nanocomposite prepared by newly developed organic modification and solubilization methods

Toshikatsu Tanaka, Tatsuya Yazawa, Yoshimichi Ohki, Mitsukazu Ochi, Miyuki Harada, Takahiro Imai

Research output: Chapter in Book/Report/Conference proceedingConference contribution

23 Citations (Scopus)

Abstract

Frequency accelerated partial discharge degradation of epoxy nanocomposite with 5 wt % additions of clay (layered silicate) was evaluated by a rod-to-plane electrode system, and investigated in comparison with that of epoxy without clay. Comparisons were made as to erosion depth using a laser surface profilometer. It was found that the change in the erosion depth is far smaller in specimens with clay than those without clay. It was also found that the solubilization method using acid anhydride curing agent seems to give PD resistance characteristics superior to the organic modification method using amine and acid anhydride curing agents and even to the solubilization method using amine curing agent.

Original languageEnglish
Title of host publication2007 International Conference on Solid Dielectrics, ICSD
Pages337-340
Number of pages4
DOIs
Publication statusPublished - 2007 Dec 1
Externally publishedYes
Event2007 International Conference on Solid Dielectrics, ICSD - Winchester, United Kingdom
Duration: 2007 Jul 82007 Jul 13

Publication series

Name2007 International Conference on Solid Dielectrics, ICSD

Conference

Conference2007 International Conference on Solid Dielectrics, ICSD
CountryUnited Kingdom
CityWinchester
Period07/7/807/7/13

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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    Tanaka, T., Yazawa, T., Ohki, Y., Ochi, M., Harada, M., & Imai, T. (2007). Frequency accelerated partial discharge resistance of epoxy/clay nanocomposite prepared by newly developed organic modification and solubilization methods. In 2007 International Conference on Solid Dielectrics, ICSD (pp. 337-340). [4290821] (2007 International Conference on Solid Dielectrics, ICSD). https://doi.org/10.1109/ICSD.2007.4290821