Fully adaptive thermal-aware routing for runtime thermal management of 3D network-on-chip

Xin Jiang, Xiangyang Lei, Lian Zeng, Takahiro Watanabe

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Thermal problem is an essential issue which must be taken Into account in the 3D Network-on-Chip NoC) design, because it has a great impact on not only the network performance, but also the reliability of the message transmission. Tn this work, we prescnt a fully adaptive runtime thermal-aware routing algorithm, which combines the distance, traffic state, path dhersity and the thermal impact in the path determination. By simultaneously considering all these factors, the routing algorithm can effectively balance the traffic load while keeping high adaptivity and routability, which also results in an even distribution of temperature across the network. Instead of collecting the topology information of the whole network, we utilize a 12 bits register to reserve the router state for one hop away, which saves the hardware cost largely and decreases the network latency. The simulation results show our proposed routing algorithm can improve the latency and energy consumption by comparing with other previously proposed thermal-aware routing schemes, and the improvement is more remarkable in large scale networks.

Original languageEnglish
Title of host publicationIMECS 2016 - International Multiconference of Engineers and Computer Scientists 2016
PublisherNewswood Limited
Pages659-664
Number of pages6
Volume2
ISBN (Electronic)9789881404763
Publication statusPublished - 2016
EventInternational Multiconference of Engineers and Computer Scientists 2016, IMECS 2016 - Tsimshatsui, Kowloon, Hong Kong
Duration: 2016 Mar 162016 Mar 18

Other

OtherInternational Multiconference of Engineers and Computer Scientists 2016, IMECS 2016
CountryHong Kong
CityTsimshatsui, Kowloon
Period16/3/1616/3/18

Fingerprint

Routing algorithms
Heat problems
Network performance
Routers
Energy utilization
Topology
Hardware
Network-on-chip
Thermal management (electronics)
Hot Temperature
Costs
Temperature

Keywords

  • 3D NoC
  • Fully adaptive
  • Routing algorithm
  • Thermal-aware
  • Visual-servoing

ASJC Scopus subject areas

  • Computer Science (miscellaneous)

Cite this

Jiang, X., Lei, X., Zeng, L., & Watanabe, T. (2016). Fully adaptive thermal-aware routing for runtime thermal management of 3D network-on-chip. In IMECS 2016 - International Multiconference of Engineers and Computer Scientists 2016 (Vol. 2, pp. 659-664). Newswood Limited.

Fully adaptive thermal-aware routing for runtime thermal management of 3D network-on-chip. / Jiang, Xin; Lei, Xiangyang; Zeng, Lian; Watanabe, Takahiro.

IMECS 2016 - International Multiconference of Engineers and Computer Scientists 2016. Vol. 2 Newswood Limited, 2016. p. 659-664.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Jiang, X, Lei, X, Zeng, L & Watanabe, T 2016, Fully adaptive thermal-aware routing for runtime thermal management of 3D network-on-chip. in IMECS 2016 - International Multiconference of Engineers and Computer Scientists 2016. vol. 2, Newswood Limited, pp. 659-664, International Multiconference of Engineers and Computer Scientists 2016, IMECS 2016, Tsimshatsui, Kowloon, Hong Kong, 16/3/16.
Jiang X, Lei X, Zeng L, Watanabe T. Fully adaptive thermal-aware routing for runtime thermal management of 3D network-on-chip. In IMECS 2016 - International Multiconference of Engineers and Computer Scientists 2016. Vol. 2. Newswood Limited. 2016. p. 659-664
Jiang, Xin ; Lei, Xiangyang ; Zeng, Lian ; Watanabe, Takahiro. / Fully adaptive thermal-aware routing for runtime thermal management of 3D network-on-chip. IMECS 2016 - International Multiconference of Engineers and Computer Scientists 2016. Vol. 2 Newswood Limited, 2016. pp. 659-664
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