Generation mechanism of electrochemical migration in printed wiring board insulation

Masashi Natsui, Hiroki Asakawa, Toshikatsu Tanaka, Yoshimichi Ohki, Takashi Maeno, Kenji Okamoto

    Research output: Contribution to journalArticle

    4 Citations (Scopus)

    Abstract

    In order to study the generation mechanism of electrochemical migration in a printed wiring board, paper/phenol-resin composites with and without an adhesive layer, epoxy resin, and a laminate of epoxy resin and a paper/phenol-resin composite were aged at 85 °C and 85% relative humidity (RH) with and without application of a DC voltage, and the space charge distributions in the samples were observed by the pulsed electroacoustic method. In the case of the composite with the adhesive layer, a large amount of negative charge is induced at the interface between the composite and the adhesive layer on the anode. It was found that such formation of space charge enhances the electric field intensity at the anode. The reason for this is because the conductivity is much lower in the adhesive layer than in the composite. Electrochemical migration does not occur when the same electric field is applied to the composite without the adhesive layer, whereas it does occur if the adhesive layer was replaced by epoxy resin with a similar conductivity to the adhesive layer. These results clearly indicate that electrochemical migration generates because the electric field at the anode surface is enhanced due to the low conductivity of the adhesive layer.

    Original languageEnglish
    Pages (from-to)200-206
    Number of pages7
    JournalIEEJ Transactions on Electrical and Electronic Engineering
    Volume6
    Issue number3
    DOIs
    Publication statusPublished - 2011 May

    Fingerprint

    Printed circuit boards
    Insulation
    Adhesives
    Composite materials
    Epoxy resins
    Anodes
    Electric fields
    Electric space charge
    Phenols
    Resins
    Charge distribution
    Laminates
    Atmospheric humidity
    Electric potential

    Keywords

    • Electrochemical migration
    • Epoxy resin
    • Paper/phenol-resin composite
    • Printed wiring board
    • Pulsed electroacoustic method
    • Space charge

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering

    Cite this

    Generation mechanism of electrochemical migration in printed wiring board insulation. / Natsui, Masashi; Asakawa, Hiroki; Tanaka, Toshikatsu; Ohki, Yoshimichi; Maeno, Takashi; Okamoto, Kenji.

    In: IEEJ Transactions on Electrical and Electronic Engineering, Vol. 6, No. 3, 05.2011, p. 200-206.

    Research output: Contribution to journalArticle

    Natsui, Masashi ; Asakawa, Hiroki ; Tanaka, Toshikatsu ; Ohki, Yoshimichi ; Maeno, Takashi ; Okamoto, Kenji. / Generation mechanism of electrochemical migration in printed wiring board insulation. In: IEEJ Transactions on Electrical and Electronic Engineering. 2011 ; Vol. 6, No. 3. pp. 200-206.
    @article{9c52c31a9f14414d9d5cb2f481270eb3,
    title = "Generation mechanism of electrochemical migration in printed wiring board insulation",
    abstract = "In order to study the generation mechanism of electrochemical migration in a printed wiring board, paper/phenol-resin composites with and without an adhesive layer, epoxy resin, and a laminate of epoxy resin and a paper/phenol-resin composite were aged at 85 °C and 85{\%} relative humidity (RH) with and without application of a DC voltage, and the space charge distributions in the samples were observed by the pulsed electroacoustic method. In the case of the composite with the adhesive layer, a large amount of negative charge is induced at the interface between the composite and the adhesive layer on the anode. It was found that such formation of space charge enhances the electric field intensity at the anode. The reason for this is because the conductivity is much lower in the adhesive layer than in the composite. Electrochemical migration does not occur when the same electric field is applied to the composite without the adhesive layer, whereas it does occur if the adhesive layer was replaced by epoxy resin with a similar conductivity to the adhesive layer. These results clearly indicate that electrochemical migration generates because the electric field at the anode surface is enhanced due to the low conductivity of the adhesive layer.",
    keywords = "Electrochemical migration, Epoxy resin, Paper/phenol-resin composite, Printed wiring board, Pulsed electroacoustic method, Space charge",
    author = "Masashi Natsui and Hiroki Asakawa and Toshikatsu Tanaka and Yoshimichi Ohki and Takashi Maeno and Kenji Okamoto",
    year = "2011",
    month = "5",
    doi = "10.1002/tee.20645",
    language = "English",
    volume = "6",
    pages = "200--206",
    journal = "IEEJ Transactions on Electrical and Electronic Engineering",
    issn = "1931-4973",
    publisher = "John Wiley and Sons Inc.",
    number = "3",

    }

    TY - JOUR

    T1 - Generation mechanism of electrochemical migration in printed wiring board insulation

    AU - Natsui, Masashi

    AU - Asakawa, Hiroki

    AU - Tanaka, Toshikatsu

    AU - Ohki, Yoshimichi

    AU - Maeno, Takashi

    AU - Okamoto, Kenji

    PY - 2011/5

    Y1 - 2011/5

    N2 - In order to study the generation mechanism of electrochemical migration in a printed wiring board, paper/phenol-resin composites with and without an adhesive layer, epoxy resin, and a laminate of epoxy resin and a paper/phenol-resin composite were aged at 85 °C and 85% relative humidity (RH) with and without application of a DC voltage, and the space charge distributions in the samples were observed by the pulsed electroacoustic method. In the case of the composite with the adhesive layer, a large amount of negative charge is induced at the interface between the composite and the adhesive layer on the anode. It was found that such formation of space charge enhances the electric field intensity at the anode. The reason for this is because the conductivity is much lower in the adhesive layer than in the composite. Electrochemical migration does not occur when the same electric field is applied to the composite without the adhesive layer, whereas it does occur if the adhesive layer was replaced by epoxy resin with a similar conductivity to the adhesive layer. These results clearly indicate that electrochemical migration generates because the electric field at the anode surface is enhanced due to the low conductivity of the adhesive layer.

    AB - In order to study the generation mechanism of electrochemical migration in a printed wiring board, paper/phenol-resin composites with and without an adhesive layer, epoxy resin, and a laminate of epoxy resin and a paper/phenol-resin composite were aged at 85 °C and 85% relative humidity (RH) with and without application of a DC voltage, and the space charge distributions in the samples were observed by the pulsed electroacoustic method. In the case of the composite with the adhesive layer, a large amount of negative charge is induced at the interface between the composite and the adhesive layer on the anode. It was found that such formation of space charge enhances the electric field intensity at the anode. The reason for this is because the conductivity is much lower in the adhesive layer than in the composite. Electrochemical migration does not occur when the same electric field is applied to the composite without the adhesive layer, whereas it does occur if the adhesive layer was replaced by epoxy resin with a similar conductivity to the adhesive layer. These results clearly indicate that electrochemical migration generates because the electric field at the anode surface is enhanced due to the low conductivity of the adhesive layer.

    KW - Electrochemical migration

    KW - Epoxy resin

    KW - Paper/phenol-resin composite

    KW - Printed wiring board

    KW - Pulsed electroacoustic method

    KW - Space charge

    UR - http://www.scopus.com/inward/record.url?scp=79953898183&partnerID=8YFLogxK

    UR - http://www.scopus.com/inward/citedby.url?scp=79953898183&partnerID=8YFLogxK

    U2 - 10.1002/tee.20645

    DO - 10.1002/tee.20645

    M3 - Article

    VL - 6

    SP - 200

    EP - 206

    JO - IEEJ Transactions on Electrical and Electronic Engineering

    JF - IEEJ Transactions on Electrical and Electronic Engineering

    SN - 1931-4973

    IS - 3

    ER -