TY - JOUR
T1 - Growth of high-quality GaN template from nanometer-size lattice channels by hydride vapor phase epitaxy
AU - Usui, A.
AU - Goto, H.
AU - Nakagawa, T.
AU - Sunakawa, H.
AU - Matsueda, T.
AU - Okada, A.
AU - Mizuno, J.
AU - Yamaguchi, A. A.
AU - Shinohara, H.
AU - Goto, H.
PY - 2013
Y1 - 2013
N2 - GaN is an attractive material in power devices for energy-saving measures in consumer products, automobiles, and industrial machines. To realize such GaN devices, however, high-quality GaN substrates are indispensable. In this paper, we describe the growth of high-crystalline-quality GaN template by HVPE with the nano-FIELO technique, where GaN growth starts by forming facet structures on nanometer-size channels which are opened on SiO2 layer deposited on GaN/sapphire substrate. The lattice pattern consisting of 500 nm × 500 nm square SiO2 masks surrounded by 80-nm-wide channels is used in this study. A nanoimprinting technique is applied followed by dry etching to fabricate lattice channels. From cross-sectional TEM observation, it is shown that the dislocation density is significantly reduced by the lattice pattern. Uniform GaN growth over 2-inch-diameter wafer is realized.
AB - GaN is an attractive material in power devices for energy-saving measures in consumer products, automobiles, and industrial machines. To realize such GaN devices, however, high-quality GaN substrates are indispensable. In this paper, we describe the growth of high-crystalline-quality GaN template by HVPE with the nano-FIELO technique, where GaN growth starts by forming facet structures on nanometer-size channels which are opened on SiO2 layer deposited on GaN/sapphire substrate. The lattice pattern consisting of 500 nm × 500 nm square SiO2 masks surrounded by 80-nm-wide channels is used in this study. A nanoimprinting technique is applied followed by dry etching to fabricate lattice channels. From cross-sectional TEM observation, it is shown that the dislocation density is significantly reduced by the lattice pattern. Uniform GaN growth over 2-inch-diameter wafer is realized.
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U2 - 10.1149/05804.0025ecst
DO - 10.1149/05804.0025ecst
M3 - Article
AN - SCOPUS:84904878911
SN - 1938-5862
VL - 58
SP - 25
EP - 31
JO - ECS Transactions
JF - ECS Transactions
IS - 4
ER -