Halogen-free and reworkable corner bond adhesive for array-based packages and the impact on board-level solder joint reliability

Hongbin Shi, Toshitsugu Ueda

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    7 Citations (Scopus)

    Abstract

    Capillary flow and no-flow underfill were demonstrated to yield dramatic reliability improvement in the mechanical shock and torsion of most array-base package (ABP) assemblies in portable electronic devices. However, it is very difficult to rework the defective ABPs after the underfill operation. Unfortunately, reworkability of the packages with underfill is needed for printed circuit board assemblies (PCBAs) with ABPs failing either during final test or in the field. Corner bond adhesive (CB A) applying an adhesive only near the corner of an ABP and curing. This adhesive forms a mechanical bridge between the ABP and the PCB, since much less adhesive is used compared to underfill, the area of adhesive in contact with the board and the package is smaller. This should aid in the ability to develop systems that are reworkable without damaging the PCB. In addition, with the improving of life quality and increasing of environmental protection thought, people's demand for environmentally friendly halogen-free products has become more and more pressing. This investigation provides initial results of an ongoing study aimed at thermo-mechanical reliability of the ABP assemblies with halogen-free and reworkable CBA in portable electronic devices. One halogen-free and reworkable CBA was evaluated in order to get the detail reliability performance for ABP assemblies. Material properties such as coefficient of thermal expansion (CTE), glass transition temperature (Tg), modulus, apparent strengths of adhesion (ASA), etc were obtained. Shear, bend, drop and thermal cycling tests have been conducted with this material. A comparative study of the performance of ABPs with one halogen reworkable CBA materials and no-bonded materials are reported. Results of the above tests shows that the halogen-free CBA has the equivalent or even better performance compared with the halogen CBA.

    Original languageEnglish
    Title of host publicationICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging
    Pages108-113
    Number of pages6
    DOIs
    Publication statusPublished - 2011
    Event2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011 - Shanghai
    Duration: 2011 Aug 82011 Aug 11

    Other

    Other2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011
    CityShanghai
    Period11/8/811/8/11

    Fingerprint

    Soldering alloys
    Adhesives
    Polychlorinated biphenyls
    Capillary flow
    Thermal cycling
    Environmental protection
    Printed circuit boards
    Torsional stress
    Thermal expansion
    Curing
    Materials properties
    Adhesion

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering

    Cite this

    Shi, H., & Ueda, T. (2011). Halogen-free and reworkable corner bond adhesive for array-based packages and the impact on board-level solder joint reliability. In ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging (pp. 108-113). [6066800] https://doi.org/10.1109/ICEPT.2011.6066800

    Halogen-free and reworkable corner bond adhesive for array-based packages and the impact on board-level solder joint reliability. / Shi, Hongbin; Ueda, Toshitsugu.

    ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. 2011. p. 108-113 6066800.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Shi, H & Ueda, T 2011, Halogen-free and reworkable corner bond adhesive for array-based packages and the impact on board-level solder joint reliability. in ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging., 6066800, pp. 108-113, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 11/8/8. https://doi.org/10.1109/ICEPT.2011.6066800
    Shi H, Ueda T. Halogen-free and reworkable corner bond adhesive for array-based packages and the impact on board-level solder joint reliability. In ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. 2011. p. 108-113. 6066800 https://doi.org/10.1109/ICEPT.2011.6066800
    Shi, Hongbin ; Ueda, Toshitsugu. / Halogen-free and reworkable corner bond adhesive for array-based packages and the impact on board-level solder joint reliability. ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. 2011. pp. 108-113
    @inproceedings{cc84609e5e744a40bedd2b080a35b60a,
    title = "Halogen-free and reworkable corner bond adhesive for array-based packages and the impact on board-level solder joint reliability",
    abstract = "Capillary flow and no-flow underfill were demonstrated to yield dramatic reliability improvement in the mechanical shock and torsion of most array-base package (ABP) assemblies in portable electronic devices. However, it is very difficult to rework the defective ABPs after the underfill operation. Unfortunately, reworkability of the packages with underfill is needed for printed circuit board assemblies (PCBAs) with ABPs failing either during final test or in the field. Corner bond adhesive (CB A) applying an adhesive only near the corner of an ABP and curing. This adhesive forms a mechanical bridge between the ABP and the PCB, since much less adhesive is used compared to underfill, the area of adhesive in contact with the board and the package is smaller. This should aid in the ability to develop systems that are reworkable without damaging the PCB. In addition, with the improving of life quality and increasing of environmental protection thought, people's demand for environmentally friendly halogen-free products has become more and more pressing. This investigation provides initial results of an ongoing study aimed at thermo-mechanical reliability of the ABP assemblies with halogen-free and reworkable CBA in portable electronic devices. One halogen-free and reworkable CBA was evaluated in order to get the detail reliability performance for ABP assemblies. Material properties such as coefficient of thermal expansion (CTE), glass transition temperature (Tg), modulus, apparent strengths of adhesion (ASA), etc were obtained. Shear, bend, drop and thermal cycling tests have been conducted with this material. A comparative study of the performance of ABPs with one halogen reworkable CBA materials and no-bonded materials are reported. Results of the above tests shows that the halogen-free CBA has the equivalent or even better performance compared with the halogen CBA.",
    author = "Hongbin Shi and Toshitsugu Ueda",
    year = "2011",
    doi = "10.1109/ICEPT.2011.6066800",
    language = "English",
    isbn = "9781457717680",
    pages = "108--113",
    booktitle = "ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging",

    }

    TY - GEN

    T1 - Halogen-free and reworkable corner bond adhesive for array-based packages and the impact on board-level solder joint reliability

    AU - Shi, Hongbin

    AU - Ueda, Toshitsugu

    PY - 2011

    Y1 - 2011

    N2 - Capillary flow and no-flow underfill were demonstrated to yield dramatic reliability improvement in the mechanical shock and torsion of most array-base package (ABP) assemblies in portable electronic devices. However, it is very difficult to rework the defective ABPs after the underfill operation. Unfortunately, reworkability of the packages with underfill is needed for printed circuit board assemblies (PCBAs) with ABPs failing either during final test or in the field. Corner bond adhesive (CB A) applying an adhesive only near the corner of an ABP and curing. This adhesive forms a mechanical bridge between the ABP and the PCB, since much less adhesive is used compared to underfill, the area of adhesive in contact with the board and the package is smaller. This should aid in the ability to develop systems that are reworkable without damaging the PCB. In addition, with the improving of life quality and increasing of environmental protection thought, people's demand for environmentally friendly halogen-free products has become more and more pressing. This investigation provides initial results of an ongoing study aimed at thermo-mechanical reliability of the ABP assemblies with halogen-free and reworkable CBA in portable electronic devices. One halogen-free and reworkable CBA was evaluated in order to get the detail reliability performance for ABP assemblies. Material properties such as coefficient of thermal expansion (CTE), glass transition temperature (Tg), modulus, apparent strengths of adhesion (ASA), etc were obtained. Shear, bend, drop and thermal cycling tests have been conducted with this material. A comparative study of the performance of ABPs with one halogen reworkable CBA materials and no-bonded materials are reported. Results of the above tests shows that the halogen-free CBA has the equivalent or even better performance compared with the halogen CBA.

    AB - Capillary flow and no-flow underfill were demonstrated to yield dramatic reliability improvement in the mechanical shock and torsion of most array-base package (ABP) assemblies in portable electronic devices. However, it is very difficult to rework the defective ABPs after the underfill operation. Unfortunately, reworkability of the packages with underfill is needed for printed circuit board assemblies (PCBAs) with ABPs failing either during final test or in the field. Corner bond adhesive (CB A) applying an adhesive only near the corner of an ABP and curing. This adhesive forms a mechanical bridge between the ABP and the PCB, since much less adhesive is used compared to underfill, the area of adhesive in contact with the board and the package is smaller. This should aid in the ability to develop systems that are reworkable without damaging the PCB. In addition, with the improving of life quality and increasing of environmental protection thought, people's demand for environmentally friendly halogen-free products has become more and more pressing. This investigation provides initial results of an ongoing study aimed at thermo-mechanical reliability of the ABP assemblies with halogen-free and reworkable CBA in portable electronic devices. One halogen-free and reworkable CBA was evaluated in order to get the detail reliability performance for ABP assemblies. Material properties such as coefficient of thermal expansion (CTE), glass transition temperature (Tg), modulus, apparent strengths of adhesion (ASA), etc were obtained. Shear, bend, drop and thermal cycling tests have been conducted with this material. A comparative study of the performance of ABPs with one halogen reworkable CBA materials and no-bonded materials are reported. Results of the above tests shows that the halogen-free CBA has the equivalent or even better performance compared with the halogen CBA.

    UR - http://www.scopus.com/inward/record.url?scp=81355132190&partnerID=8YFLogxK

    UR - http://www.scopus.com/inward/citedby.url?scp=81355132190&partnerID=8YFLogxK

    U2 - 10.1109/ICEPT.2011.6066800

    DO - 10.1109/ICEPT.2011.6066800

    M3 - Conference contribution

    AN - SCOPUS:81355132190

    SN - 9781457717680

    SP - 108

    EP - 113

    BT - ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging

    ER -