TY - GEN
T1 - Heterogeneously Integrated III-V/Si Mach-Zehnder Modulator
AU - Hiraki, T.
AU - Aihara, T.
AU - Hasebe, K.
AU - Fujii, T.
AU - Takeda, K.
AU - Tsuchizawa, T.
AU - Kakitsuka, T.
AU - Fukuda, H.
AU - Matsuo, S.
PY - 2018/7
Y1 - 2018/7
N2 - A heterogeneously integrated metal-oxide-semiconductor capacitor Mach-Zehnder modulator with an n-type InGaAsP layer shows VπL of 0.09 Vcm. It overcomes the VπL limit of conventional Si modulators without degrading the optical loss.
AB - A heterogeneously integrated metal-oxide-semiconductor capacitor Mach-Zehnder modulator with an n-type InGaAsP layer shows VπL of 0.09 Vcm. It overcomes the VπL limit of conventional Si modulators without degrading the optical loss.
UR - http://www.scopus.com/inward/record.url?scp=85067993887&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85067993887&partnerID=8YFLogxK
U2 - 10.1109/OECC.2018.8730095
DO - 10.1109/OECC.2018.8730095
M3 - Conference contribution
AN - SCOPUS:85067993887
T3 - 23rd Opto-Electronics and Communications Conference, OECC 2018
BT - 23rd Opto-Electronics and Communications Conference, OECC 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 23rd Opto-Electronics and Communications Conference, OECC 2018
Y2 - 2 July 2018 through 6 July 2018
ER -