Abstract
Poly(tetrafluoroethylene) (PTFE) microstructure with high aspect ratio (> 200) and without solid debris along the edge was fabricated with high etch rate using FIB. Evolution of PTFE by FIB is responsible for the high aspect ratio, the high etch rate, and the no solid debris. Roughness of etched surface of the PTEE increases with fluence, although edge of the etched area has good profiles. The etch mechanism seems to be complicated.
| Original language | English |
|---|---|
| Title of host publication | Ion-Beam-Based Nanofabrication |
| Pages | 61-66 |
| Number of pages | 6 |
| Publication status | Published - 2007 Dec 1 |
| Event | Ion-Beam-Based Nanofabrication - San Francisco, CA, United States Duration: 2007 Apr 10 → 2007 Apr 12 |
Publication series
| Name | Materials Research Society Symposium Proceedings |
|---|---|
| Volume | 1020 |
| ISSN (Print) | 0272-9172 |
Conference
| Conference | Ion-Beam-Based Nanofabrication |
|---|---|
| Country | United States |
| City | San Francisco, CA |
| Period | 07/4/10 → 07/4/12 |
ASJC Scopus subject areas
- Materials Science(all)
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering
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Cite this
Matsui, Y., Miyoshi, N., Oshima, A., Seki, S., Washio, M., & Tagawa, S. (2007). High-aspect-ratio micromachining of fluoropolymers using focused ion beam. In Ion-Beam-Based Nanofabrication (pp. 61-66). (Materials Research Society Symposium Proceedings; Vol. 1020).