High-aspect-ratio micromachining of fluoropolymers using focused ion beam

Yoshinori Matsui, Nozomi Miyoshi, Akihiro Oshima, Shu Seki, Masakazu Washio, Seiichi Tagawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Poly(tetrafluoroethylene) (PTFE) microstructure with high aspect ratio (> 200) and without solid debris along the edge was fabricated with high etch rate using FIB. Evolution of PTFE by FIB is responsible for the high aspect ratio, the high etch rate, and the no solid debris. Roughness of etched surface of the PTEE increases with fluence, although edge of the etched area has good profiles. The etch mechanism seems to be complicated.

Original languageEnglish
Title of host publicationIon-Beam-Based Nanofabrication
Pages61-66
Number of pages6
Publication statusPublished - 2007 Dec 1
EventIon-Beam-Based Nanofabrication - San Francisco, CA, United States
Duration: 2007 Apr 102007 Apr 12

Publication series

NameMaterials Research Society Symposium Proceedings
Volume1020
ISSN (Print)0272-9172

Conference

ConferenceIon-Beam-Based Nanofabrication
CountryUnited States
CitySan Francisco, CA
Period07/4/1007/4/12

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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  • Cite this

    Matsui, Y., Miyoshi, N., Oshima, A., Seki, S., Washio, M., & Tagawa, S. (2007). High-aspect-ratio micromachining of fluoropolymers using focused ion beam. In Ion-Beam-Based Nanofabrication (pp. 61-66). (Materials Research Society Symposium Proceedings; Vol. 1020).