High-aspect-ratio micromachining of fluoropolymers using focused ion beam

Yoshinori Matsui; Nozomi Miyoshi; Akihiro Oshima; Shu Seki; Masakazu Washio; Seiichi Tagawa

High-aspect-ratio micromachining of fluoropolymers using focused ion beam

Yoshinori Matsui, Nozomi Miyoshi, Akihiro Oshima, Shu Seki, Masakazu Washio, Seiichi Tagawa

School of Advanced Science and Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Poly(tetrafluoroethylene) (PTFE) microstructure with high aspect ratio (> 200) and without solid debris along the edge was fabricated with high etch rate using FIB. Evolution of PTFE by FIB is responsible for the high aspect ratio, the high etch rate, and the no solid debris. Roughness of etched surface of the PTEE increases with fluence, although edge of the etched area has good profiles. The etch mechanism seems to be complicated.

Original language	English
Title of host publication	Ion-Beam-Based Nanofabrication
Pages	61-66
Number of pages	6
Publication status	Published - 2007 Dec 1
Event	Ion-Beam-Based Nanofabrication - San Francisco, CA, United States Duration: 2007 Apr 10 → 2007 Apr 12

Publication series

Name	Materials Research Society Symposium Proceedings
Volume	1020
ISSN (Print)	0272-9172

Conference

Conference	Ion-Beam-Based Nanofabrication
Country	United States
City	San Francisco, CA
Period	07/4/10 → 07/4/12

ASJC Scopus subject areas

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

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High-aspect-ratio micromachining of fluoropolymers using focused ion beam. / Matsui, Yoshinori; Miyoshi, Nozomi; Oshima, Akihiro; Seki, Shu; Washio, Masakazu; Tagawa, Seiichi.

Ion-Beam-Based Nanofabrication. 2007. p. 61-66 (Materials Research Society Symposium Proceedings; Vol. 1020).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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abstract = "Poly(tetrafluoroethylene) (PTFE) microstructure with high aspect ratio (> 200) and without solid debris along the edge was fabricated with high etch rate using FIB. Evolution of PTFE by FIB is responsible for the high aspect ratio, the high etch rate, and the no solid debris. Roughness of etched surface of the PTEE increases with fluence, although edge of the etched area has good profiles. The etch mechanism seems to be complicated.",

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AU - Matsui, Yoshinori

AU - Miyoshi, Nozomi

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AU - Seki, Shu

AU - Washio, Masakazu

AU - Tagawa, Seiichi

PY - 2007/12/1

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AB - Poly(tetrafluoroethylene) (PTFE) microstructure with high aspect ratio (> 200) and without solid debris along the edge was fabricated with high etch rate using FIB. Evolution of PTFE by FIB is responsible for the high aspect ratio, the high etch rate, and the no solid debris. Roughness of etched surface of the PTEE increases with fluence, although edge of the etched area has good profiles. The etch mechanism seems to be complicated.

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Y2 - 10 April 2007 through 12 April 2007

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