Abstract
Poly(tetrafluoroethylene) (PTFE) microstructure with high aspect ratio (> 200) and without solid debris along the edge was fabricated with high etch rate using FIB. Evolution of PTFE by FIB is responsible for the high aspect ratio, the high etch rate, and the no solid debris. Roughness of etched surface of the PTEE increases with fluence, although edge of the etched area has good profiles. The etch mechanism seems to be complicated.
| Original language | English |
|---|---|
| Title of host publication | Materials Research Society Symposium Proceedings |
| Pages | 61-66 |
| Number of pages | 6 |
| Volume | 1020 |
| Publication status | Published - 2007 |
| Event | Ion-Beam-Based Nanofabrication - San Francisco, CA Duration: 2007 Apr 10 → 2007 Apr 12 |
Other
| Other | Ion-Beam-Based Nanofabrication |
|---|---|
| City | San Francisco, CA |
| Period | 07/4/10 → 07/4/12 |
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ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
Cite this
High-aspect-ratio micromachining of fluoropolymers using focused ion beam. / Matsui, Yoshinori; Miyoshi, Nozomi; Oshima, Akihiro; Seki, Shu; Washio, Masakazu; Tagawa, Seiichi.
Materials Research Society Symposium Proceedings. Vol. 1020 2007. p. 61-66.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - High-aspect-ratio micromachining of fluoropolymers using focused ion beam
AU - Matsui, Yoshinori
AU - Miyoshi, Nozomi
AU - Oshima, Akihiro
AU - Seki, Shu
AU - Washio, Masakazu
AU - Tagawa, Seiichi
PY - 2007
Y1 - 2007
N2 - Poly(tetrafluoroethylene) (PTFE) microstructure with high aspect ratio (> 200) and without solid debris along the edge was fabricated with high etch rate using FIB. Evolution of PTFE by FIB is responsible for the high aspect ratio, the high etch rate, and the no solid debris. Roughness of etched surface of the PTEE increases with fluence, although edge of the etched area has good profiles. The etch mechanism seems to be complicated.
AB - Poly(tetrafluoroethylene) (PTFE) microstructure with high aspect ratio (> 200) and without solid debris along the edge was fabricated with high etch rate using FIB. Evolution of PTFE by FIB is responsible for the high aspect ratio, the high etch rate, and the no solid debris. Roughness of etched surface of the PTEE increases with fluence, although edge of the etched area has good profiles. The etch mechanism seems to be complicated.
UR - http://www.scopus.com/inward/record.url?scp=45749123069&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=45749123069&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:45749123069
SN - 9781558999800
VL - 1020
SP - 61
EP - 66
BT - Materials Research Society Symposium Proceedings
ER -