High aspect ratio micromachining Teflon by direct exposure to synchrotron radiation

Y. Zhang, T. Katoh, Masakazu Washio, H. Yamada, S. Hamada

Research output: Contribution to journalArticle

95 Citations (Scopus)

Abstract

Micromachining Teflon was achieved by direct exposure to synchrotron radiation and the microstructures made had the smallest surface detail down to 20 μm with structural height of more than 200 μm, that is, aspect ratio on the order of 10. The quality of micromachining Teflon by this process was found to be critically dependent on photon flux of the synchrotron radiation. Analysis of the mass distribution of gaseous species formed upon this process suggested that photochemical processes rather than pyrolytic processes may still dominate.

Original languageEnglish
Pages (from-to)872
Number of pages1
JournalApplied Physics Letters
Volume67
DOIs
Publication statusPublished - 1995
Externally publishedYes

Fingerprint

teflon (trademark)
micromachining
high aspect ratio
synchrotron radiation
mass distribution
aspect ratio
microstructure
photons

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

Cite this

High aspect ratio micromachining Teflon by direct exposure to synchrotron radiation. / Zhang, Y.; Katoh, T.; Washio, Masakazu; Yamada, H.; Hamada, S.

In: Applied Physics Letters, Vol. 67, 1995, p. 872.

Research output: Contribution to journalArticle

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