High aspect ratio nano-scale CFX structures fabricated by deep-RIE

Takahiro Arakawa, Hiroyuki Kusakawa, Shuichi Shoji

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

High aspect ratio (>500) nano-scale CFx (fluorocarbon) "tube" and "test-tube" arrays were realized using Deep Reactive Ion Etching (RIE). Sidewall CFx nano structures of 200 nm in thickness formed during Deep RIE passivation process were used for the purpose. The film thickness of CFx was controlled from 200 nm to 500 nm, and the height more than 100 μm was available. As a result, the aspect ratio is larger than 500. This fluorocarbon tube and test-tube array are useful tools for chemical and biological applications.

Original languageEnglish
Title of host publicationProceedings - CIS Workshops 2007, 2007 International Conference on Computational Intelligence and Security Workshops, CISW 2007
Pages287-290
Number of pages4
Publication statusPublished - 2007 Dec 1
Event20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007 - Kobe, Japan
Duration: 2007 Jan 212007 Jan 25

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Conference

Conference20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007
CountryJapan
CityKobe
Period07/1/2107/1/25

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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    Arakawa, T., Kusakawa, H., & Shoji, S. (2007). High aspect ratio nano-scale CFX structures fabricated by deep-RIE. In Proceedings - CIS Workshops 2007, 2007 International Conference on Computational Intelligence and Security Workshops, CISW 2007 (pp. 287-290). [4432970] (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).