High aspect ratio nano-scale CFX structures fabricated by deep-RIE

Takahiro Arakawa, Hiroyuki Kusakawa, Shuichi Shoji

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    High aspect ratio (>500) nano-scale CFx (fluorocarbon) "tube" and "test-tube" arrays were realized using Deep Reactive Ion Etching (RIE). Sidewall CFx nano structures of 200 nm in thickness formed during Deep RIE passivation process were used for the purpose. The film thickness of CFx was controlled from 200 nm to 500 nm, and the height more than 100 μm was available. As a result, the aspect ratio is larger than 500. This fluorocarbon tube and test-tube array are useful tools for chemical and biological applications.

    Original languageEnglish
    Title of host publicationProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
    Pages287-290
    Number of pages4
    Publication statusPublished - 2007
    Event20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007 - Kobe
    Duration: 2007 Jan 212007 Jan 25

    Other

    Other20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007
    CityKobe
    Period07/1/2107/1/25

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    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Mechanical Engineering
    • Condensed Matter Physics
    • Electronic, Optical and Magnetic Materials

    Cite this

    Arakawa, T., Kusakawa, H., & Shoji, S. (2007). High aspect ratio nano-scale CFX structures fabricated by deep-RIE. In Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS) (pp. 287-290). [4432970]