High-aspect-ratio Sub-2-μm vias using thermal imprint with build-up resin

Takumi Kamibayashi*, Hiroyuki Kuwae, Takahiro Kishioka, Yuki Usui, Takuya Ohashi, Mamoru Tamura, Shuichi Shoji, Jun Mizuno

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Fingerprint

Dive into the research topics of 'High-aspect-ratio Sub-2-μm vias using thermal imprint with build-up resin'. Together they form a unique fingerprint.

Engineering & Materials Science