High Performance Flexible Thermoelectric Device Included Rigid Material

Makoto Kashiwagi, Tomoya Koshi, Eiji Iwase

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

A Thermoelectric device (TE-device) is promising way to achieve energy harvesting from wasted heat. For energy harvesting, flexibility and stretchability are necessary since a heat source surface has complex shape such as free-form surface. We realized high performance flexible TE-device which combining rigid BiTe-based thermoelectric elements (TE-elements) and flexible structures such as stretchable substrate and expandable electrical wirings. In this device, the BiTe-based TE-elements ensures thermoelectric performance and the flexible structures ensures flexibility. By designing as that, the device has high thermoelectric conversion performance which is comparable with conventional TE-device while having flexibility.

Original languageEnglish
Title of host publication2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems, MEMS 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1010-1012
Number of pages3
ISBN (Electronic)9781728116105
DOIs
Publication statusPublished - 2019 Jan
Event32nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2019 - Seoul, Korea, Republic of
Duration: 2019 Jan 272019 Jan 31

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Volume2019-January
ISSN (Print)1084-6999

Conference

Conference32nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2019
CountryKorea, Republic of
CitySeoul
Period19/1/2719/1/31

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Kashiwagi, M., Koshi, T., & Iwase, E. (2019). High Performance Flexible Thermoelectric Device Included Rigid Material. In 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems, MEMS 2019 (pp. 1010-1012). [8870805] (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); Vol. 2019-January). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MEMSYS.2019.8870805