High performance virtual channel based fully adaptive thermal-aware routing for 3D NoC

Xin Jiang, Xiangyang Lei, Lian Zeng, Takahiro Watanabe

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

The thermal problem is a challenge in recent Network on Chip (NoC) designs due to its great impact on the network performance and reliability, especially for 3D NoC. In this work, we design a virtual channel based fully adaptive routing algorithm for the runtime 3D NoC thermal-aware management. For throttling information collection, instead of transmitting the topology information of the whole network, we use a 12 bits register to reserve the router state for one hop away instead of transmitting the topology information of the whole network. It saves the hardware cost largely and decreases the network latency. To ensure deadlock and livelock free and minimize the hardware overhead, we only use two virtual channels for each horizontal channel to achieve full adaptivity and high routability. For path selection, we design a strategy that takes priority to the distance, but also consider path diversity and traffic state. Experimental results show that the proposed algorithm shows better network latency and throughput with low power compared with traditional algorithms.

Original languageEnglish
Title of host publicationProceedings of the 18th International Symposium on Quality Electronic Design, ISQED 2017
PublisherIEEE Computer Society
Pages289-295
Number of pages7
ISBN (Electronic)9781509054046
DOIs
Publication statusPublished - 2017 May 2
Event18th International Symposium on Quality Electronic Design, ISQED 2017 - Santa Clara, United States
Duration: 2017 Mar 142017 Mar 15

Other

Other18th International Symposium on Quality Electronic Design, ISQED 2017
CountryUnited States
CitySanta Clara
Period17/3/1417/3/15

Fingerprint

Topology
Hardware
Heat problems
Routing algorithms
Network performance
Adaptive algorithms
Routers
Throughput
Hot Temperature
Network-on-chip
Costs

Keywords

  • 3D NoC
  • fully adaptive
  • routing algorithm
  • thermal-aware

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality

Cite this

Jiang, X., Lei, X., Zeng, L., & Watanabe, T. (2017). High performance virtual channel based fully adaptive thermal-aware routing for 3D NoC. In Proceedings of the 18th International Symposium on Quality Electronic Design, ISQED 2017 (pp. 289-295). [7918330] IEEE Computer Society. https://doi.org/10.1109/ISQED.2017.7918330

High performance virtual channel based fully adaptive thermal-aware routing for 3D NoC. / Jiang, Xin; Lei, Xiangyang; Zeng, Lian; Watanabe, Takahiro.

Proceedings of the 18th International Symposium on Quality Electronic Design, ISQED 2017. IEEE Computer Society, 2017. p. 289-295 7918330.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Jiang, X, Lei, X, Zeng, L & Watanabe, T 2017, High performance virtual channel based fully adaptive thermal-aware routing for 3D NoC. in Proceedings of the 18th International Symposium on Quality Electronic Design, ISQED 2017., 7918330, IEEE Computer Society, pp. 289-295, 18th International Symposium on Quality Electronic Design, ISQED 2017, Santa Clara, United States, 17/3/14. https://doi.org/10.1109/ISQED.2017.7918330
Jiang X, Lei X, Zeng L, Watanabe T. High performance virtual channel based fully adaptive thermal-aware routing for 3D NoC. In Proceedings of the 18th International Symposium on Quality Electronic Design, ISQED 2017. IEEE Computer Society. 2017. p. 289-295. 7918330 https://doi.org/10.1109/ISQED.2017.7918330
Jiang, Xin ; Lei, Xiangyang ; Zeng, Lian ; Watanabe, Takahiro. / High performance virtual channel based fully adaptive thermal-aware routing for 3D NoC. Proceedings of the 18th International Symposium on Quality Electronic Design, ISQED 2017. IEEE Computer Society, 2017. pp. 289-295
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