High perpendicular coercivity electroless cobalt alloy films with 25 nm thicknesses

T. Ouchi, Y. Arikawa, T. Kuno, T. Homma

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This paper describes the development of Co alloy films thinner than 50 nm with high perpendicular magnetic coercivity using an electroless deposition process. In order to obtain these films, we used a Cu underlayer for a heteroepitaxial growth of the Co alloys and an optimized bath composition which included sodium hypophosphite and hydrazine as reductants. As a results, the perpendicular coercivity of the films turned to be higher 3000 Oe at the initial deposition stage with the thickness lower than 80 nm. In particular, the high perpendicular magnetic coercivity of the film as thin as 25 nm thick was obtained. These results indicate that electroless deposition is applicable for formation of the films with high perpendicular magnetic coercivity by optimizing the deposition conditions.

Original languageEnglish
Title of host publicationElectrodeposition of Nanoengineered Materials and Devices 3
Pages125-134
Number of pages10
Edition41
DOIs
Publication statusPublished - 2010 Dec 1
EventElectrodeposition of Nanoengineered Materials and Devices 3 - 216th ECS Meeting - Vienna, Austria
Duration: 2009 Oct 42009 Oct 9

Publication series

NameECS Transactions
Number41
Volume25
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

Conference

ConferenceElectrodeposition of Nanoengineered Materials and Devices 3 - 216th ECS Meeting
CountryAustria
CityVienna
Period09/10/409/10/9

ASJC Scopus subject areas

  • Engineering(all)

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  • Cite this

    Ouchi, T., Arikawa, Y., Kuno, T., & Homma, T. (2010). High perpendicular coercivity electroless cobalt alloy films with 25 nm thicknesses. In Electrodeposition of Nanoengineered Materials and Devices 3 (41 ed., pp. 125-134). (ECS Transactions; Vol. 25, No. 41). https://doi.org/10.1149/1.3422506