High-quality SiO2 film formation by highly concentrated ozone gas at below 600°C

Tetsuya Nishiguchi, Hidehiko Nonaka, Shingo Ichimura, Yoshiki Morikawa, Mitsuru Kekura, Masaharu Miyamoto

Research output: Contribution to journalArticle

45 Citations (Scopus)

Abstract

Highly concentrated (>93 vol%) ozone (O3) gas was used to oxidize silicon for obtaining high-quality SiO2 film at low temperature. Compared to O2 oxidation, more than 500°C lower temperature oxidation (i.e., from 830 to 330°C) has been enabled for achieving the same SiO2 growth rate. A 6 nm SiO2 film, for example, could be grown at 600°C within 3 min at 900 Pa O3 atmosphere. The temperature dependence of the oxidation rate is relatively low, giving an activation energy for the parabolic rate constant of 0.32 eV. Furthermore, a 400°C grown SiO2 film was found to have satisfactory electrical properties with a small interface trap density (5×1010cm-2/eV) and large breakdown field (14 MV/cm).

Original languageEnglish
Pages (from-to)2190-2192
Number of pages3
JournalApplied Physics Letters
Volume81
Issue number12
DOIs
Publication statusPublished - 2002 Sep 16
Externally publishedYes

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ozone
oxidation
gases
breakdown
electrical properties
traps
activation energy
atmospheres
temperature dependence
silicon

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

Cite this

High-quality SiO2 film formation by highly concentrated ozone gas at below 600°C. / Nishiguchi, Tetsuya; Nonaka, Hidehiko; Ichimura, Shingo; Morikawa, Yoshiki; Kekura, Mitsuru; Miyamoto, Masaharu.

In: Applied Physics Letters, Vol. 81, No. 12, 16.09.2002, p. 2190-2192.

Research output: Contribution to journalArticle

Nishiguchi, T, Nonaka, H, Ichimura, S, Morikawa, Y, Kekura, M & Miyamoto, M 2002, 'High-quality SiO2 film formation by highly concentrated ozone gas at below 600°C', Applied Physics Letters, vol. 81, no. 12, pp. 2190-2192. https://doi.org/10.1063/1.1507829
Nishiguchi, Tetsuya ; Nonaka, Hidehiko ; Ichimura, Shingo ; Morikawa, Yoshiki ; Kekura, Mitsuru ; Miyamoto, Masaharu. / High-quality SiO2 film formation by highly concentrated ozone gas at below 600°C. In: Applied Physics Letters. 2002 ; Vol. 81, No. 12. pp. 2190-2192.
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